Datasheet

MOTOROLA CMOS LOGIC DATA
349
MC14508B
OUTLINE DIMENSIONS
P SUFFIX
PLASTIC DIP PACKAGE
CASE 709–02
ISSUE C
L SUFFIX
CERAMIC DIP PACKAGE
CASE 623–05
ISSUE M
NOTES:
1. POSITIONAL TOLERANCE OF LEADS (D),
SHALL BE WITHIN 0.25 (0.010) AT MAXIMUM
MATERIAL CONDITION, IN RELATION TO
SEATING PLANE AND EACH OTHER.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 31.37 32.13 1.235 1.265
B 13.72 14.22 0.540 0.560
C 3.94 5.08 0.155 0.200
D 0.36 0.56 0.014 0.022
F 1.02 1.52 0.040 0.060
G 2.54 BSC 0.100 BSC
H 1.65 2.03 0.065 0.080
J 0.20 0.38 0.008 0.015
K 2.92 3.43 0.115 0.135
L 15.24 BSC 0.600 BSC
M 0 15 0 15
N 0.51 1.02 0.020 0.040
1 12
1324
B
H
A
F
D
G
K
SEATING
PLANE
N
C
M
J
L
NOTES:
1. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
2. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE
POSITION AT SEATING PLANE AT MAXIMUM
MATERIAL CONDITION (WHEN FORMED
PARALLEL).
1 12
24 13
B
A
SEATING
PLANE
F
D
G
K
N
C
M
J
L
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 31.24 32.77 1.230 1.290
B 12.70 15.49 0.500 0.610
C 4.06 5.59 0.160 0.220
D 0.41 0.51 0.016 0.020
F 1.27 1.52 0.050 0.060
G 2.54 BSC 0.100 BSC
J 0.20 0.30 0.008 0.012
K 3.18 4.06 0.125 0.160
L 15.24 BSC 0.600 BSC
M 0 15 0 15
N 0.51 1.27 0.020 0.050