Datasheet
®
ACF2101
4
ABSOLUTE MAXIMUM RATINGS
Supply ............................................................................................... ±18V
Input Current ..................................................................................... ±5mA
Output Short Circuit Duration .................................. Continuous to Ground
Power Dissipation .......................................................................... 500mW
Operating Temperature .................................................. –40°C to +125°C
Storage Temperature ...................................................... –40°C to +125°C
Junction Temperature .................................................................... +150°C
Lead Temperature (soldering, 10s) ............................................... +300°C
ELECTROSTATIC
DISCHARGE SENSITIVITY
Electrostatic discharge can cause damage ranging from per-
formance degradation to complete device failure. Burr-
Brown Corporation recommends that all integrated circuits
be handled and stored using appropriate ESD protection
methods.
PACKAGE
DRAWING TEMPERATURE
PRODUCT PACKAGE NUMBER
(1)
RANGE
ACF2101BP 24-Pin Plastic DIP 243 –40°C to +85°C
ACF2101BU 24-Pin Plastic SOIC 239 –40°C to +85°C
NOTE: (1) For detailed drawing and dimension table, please see end of data
sheet, or Appendix C of Burr-Brown IC Data Book.
PACKAGE/ORDERING INFORMATION
TOP VIEW ACF2101BU
PIN CONFIGURATION
DIP and SOIC package have different pinouts.
TOP VIEW ACF2101BP
1
2
3
4
5
6
7
8
9
10
11
12
24
23
22
21
20
19
18
17
16
15
14
13
DIP
Out A
Gnd A
Com A
Cap A
In A
Sw In A
Sw In B
In B
Cap B
Com B
Gnd B
Out B
Sw Out A
Sw Com A
Select A
Reset A
Hold A
V+
V–
Hold B
Reset B
Select B
Sw Com B
Sw Out B
1
2
3
4
5
6
7
8
9
10
11
12
24
23
22
21
20
19
18
17
16
15
14
13
Sw In B
In B
Cap B
Com B
Gnd B
Out B
Sw Out B
Sw Com B
Select B
Reset B
Hold B
V–
Sw In A
In A
Cap A
Com A
Gnd A
Out A
Sw Out A
Sw Com A
Select A
Reset A
Hold A
V+
SOIC