Datasheet

220
210
200
190
180
170
160
150
140
130
120
TemperatureSensorVoltage(mV)
-40
Temperature( C)°
120-20 0 20 6040 10080
OnlyADS1258
TemperatureForced;
TestPCBinFree-Air
ADS1258andTestPCB
TemperaturesForcedTogether
Number of Occurrences
Temperature Reading (
_
C)
8
7
6
5
4
3
2
1
0
12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36
50 units from two production lots.
T
A
= +25
_
C
Ratio (
µ
A/
µ
A)
Temperature (
_
C)
18
17
16
15
14
−
40
−
20 120100
0 20 806040
Number of Occurrences
Ratio (
µ
A/
µ
A)
25
20
15
10
5
0
14.0 14.5 15.0 15.5 16.0 16.5 17.0 17.5 18.0 18.5 19.0
50 units from two production lots.
AVDD, AVSS Current (mA)
Temperature (
_
C)
10
8
6
4
2
0
DVDD Current (mA)
1.0
0.8
0.6
0.4
0.2
0
−
40
−
20 120
0 20 40 60 80 100
AVDD, AVSS
DVDD
RMS Noise (
µ
V)
Master Clock (MHz)
20
16
12
8
4
0
Linearity Error (ppm)
20
16
12
8
4
0
0.1 1 10010
DRATE[1:0] = 11
Noise
Linearity
ADS1258
SBAS297G –JUNE 2005– REVISED MARCH 2011 www.ti.com
TYPICAL CHARACTERISTICS (continued)
At T
A
= +25°C, AVDD = +2.5V, AVSS = –2.5V, DVDD = +3.3V, f
CLK
= 16MHz (external clock) or f
CLK
= 15.729MHz (internal
clock), OPA227 buffer between MUX outputs and ADC inputs, VREFP = +2.048V, and VREFN = –2.048V, unless otherwise
noted.
TEMPERATURE SENSOR VOLTAGE vs TEMPERATURE TEMPERATURE SENSOR READING HISTOGRAM
Figure 27. Figure 28.
SENSOR BIAS CURRENT SOURCE RATIO SENSOR BIAS CURRENT SOURCE RATIO
HISTOGRAM vs TEMPERATURE
Figure 29. Figure 30.
SUPPLY CURRENT vs TEMPERATURE NOISE AND INL vs MASTER CLOCK
Figure 31. Figure 32.
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