Datasheet

ADS8318
SLAS568A MAY 2008 REVISED MARCH 2011
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION
(1)
MAXIMUM MAXIMUM NO MISSING
TRANSPORT
INTEGRAL DIFFERENTIAL CODES AT PACKAGE PACKAGE TEMPERATURE PACKAGE ORDERING
DEVICE MEDIA
LINEARITY LINEARITY RESOLUTION TYPE DESIGNATOR RANGE MARKING INFORMATION
QUANTITY
(LSB) (LSB) (BIT)
ADS8318IDGST 250
10 Pin MSOP DGS CBC
ADS8318IDGSR 2500
ADS8318I ±1.5 ±1 16 40°C to 85°C
ADS8318IDRCT 250
10 Pin SON DRC CBE
ADS8318IDRCR 2500
ADS8318IBDGST 250
10 Pin MSOP DGS CBC
ADS8318IBDGSR 2500
ADS8318IB ±1.0 ±0.75 16 40°C to 85°C
ADS8318IBDRCT 250
10 Pin SON DRC CBE
ADS8318IBDRCR 2500
(1) For the most current specifications and ordering information, see the Package Option Addendum at the end of this document, or see the
TI website at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted
(1)
VALUE UNIT
0.3 to +VA + 0.3 V
+IN
±130 mA
0.3 to +VA + 0.3 V
IN
±130 mA
+VA to AGND 0.3 to 7 V
+VBD to BDGND 0.3 to 7 V
Digital input voltage to GND 0.3 to +VBD + 0.3 V
Digital output to GND 0.3 to +VBD + 0.3 V
T
A
Operating free-air temperature range 40 to 85 °C
T
stg
Storage temperature range 65 to 150 °C
Junction temperature (T
J
max) 150 °C
Power dissipation (T
J
Max T
A
)/θ
JA
°C
MSOP package
θ
JA
thermal impedance 180 °C/W
ADS8318 is rated to MSL2 260°C per the
Maximum MSOP reflow temperature
JSTD-020 specification
Power dissipation (T
J
Max T
A
)/θ
JA
SON package
θ
JA
thermal impedance 70 °C/W
ADS8318 is rated to MSL2 260°C per the
Maximum SON reflow temperature
JSTD-020 specification
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
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