Datasheet

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ABSOLUTE MAXIMUM RATINGS
(1)
ADS8484
SLAS511 NOVEMBER 2007
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
(1)
MAXIMUM MAXIMUM
NO MISSING CODES TRANSPORT
INTEGRAL DIFFERENTIAL PACKAGE PACKAGE TEMPERATURE ORDERING
MODEL RESOLUTION MEDIA
LINEARITY LINEARITY TYPE DESIGNATOR RANGE INFORMATION
(BIT) QTY.
(LSB) (LSB)
Tape and reel
ADS8484IRGZT
250
7x7 48 Pin
ADS8484I ± 4 1 to +2 18 RGZ -40 ° C to 85 ° C
QFN
Tape and reel
ADS8484IRGZR
1000
Tape and reel
ADS8484IBRGZT
250
7x7 48 Pin
ADS8484IB ± 2.5 1 to +1.5 18 RGZ -40 ° C to 85 ° C
QFN
Tape and reel
ADS8484IBRGZR
1000
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com .
over operating free-air temperature range (unless otherwise noted)
VALUE UNIT
+IN to AGND 0.4 to +VA + 0.1 V
IN to AGND 0.4 to +VA + 0.1 V
Voltage +VA to AGND 0.3 to 7 V
+VBD to BDGND 0.3 to 7 V
+VA to +VBD 0.3 to 2.55 V
Digital input voltage to BDGND 0.3 to +VBD + 0.3 V
Digital output voltage to BDGND 0.3 to +VBD + 0.3 V
T
A
Operating free-air temperature range 40 to 85 ° C
T
stg
Storage temperature range 65 to 150 ° C
Junction temperature (T
J
max) 150 ° C
Power dissipation (T
J
Max T
A
)/ θ
JA
QFN package
θ
JA
thermal impedance 22 ° C/W
Vapor phase (60 sec) 215 ° C
Lead temperature, soldering
Infrared (15 sec) 220 ° C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
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