Datasheet

*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
AM26C31CDBR SSOP DB 16 2000 367.0 367.0 38.0
AM26C31CDR SOIC D 16 2500 333.2 345.9 28.6
AM26C31IDBR SSOP DB 16 2000 367.0 367.0 38.0
AM26C31IDR SOIC D 16 2500 333.2 345.9 28.6
AM26C31IDR SOIC D 16 2500 364.0 364.0 27.0
AM26C31IDRG4 SOIC D 16 2500 333.2 345.9 28.6
AM26C31IPWR TSSOP PW 16 2000 367.0 367.0 35.0
AM26C31QDR SOIC D 16 2500 367.0 367.0 38.0
AM26C31QDRG4 SOIC D 16 2500 333.2 345.9 28.6
PACKAGE MATERIALS INFORMATION
www.ti.com 5-Oct-2013
Pack Materials-Page 2