Datasheet

PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
5962-9164001Q2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962-
9164001Q2A
AM26C32
MFKB
5962-9164001QEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9164001QE
A
AM26C32MJB
5962-9164001QFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9164001QF
A
AM26C32MWB
AM26C32-W ACTIVE WAFERSALE YS 0 3624 TBD Call TI Call TI
AM26C32CD ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 AM26C32C
AM26C32CDBLE OBSOLETE SSOP DB 16 TBD Call TI Call TI 0 to 70
AM26C32CDE4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 AM26C32C
AM26C32CDG4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 AM26C32C
AM26C32CDR ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 AM26C32C
AM26C32CDRE4 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 AM26C32C
AM26C32CDRG4 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 AM26C32C
AM26C32CN ACTIVE PDIP N 16 25 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type 0 to 70 AM26C32CN
AM26C32CNE4 ACTIVE PDIP N 16 25 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type 0 to 70 AM26C32CN
AM26C32CNSR ACTIVE SO NS 16 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 26C32
AM26C32CNSRE4 ACTIVE SO NS 16 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 26C32
AM26C32CNSRG4 ACTIVE SO NS 16 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 26C32