Datasheet

AM3517, AM3505
www.ti.com SPRS550E –OCTOBER 2009–REVISED MARCH 2013
7 Package Characteristics
7.1 Package Thermal Resistance
Table 7-1 provides the thermal resistance characteristics for the recommended package types used on the
AM3517/05.
Table 7-1. AM3517/05 Thermal Resistance Characteristics
(1)
BOARD TYPE
PACKAGE POWER (W) R
JA
(C/W) R
JB
(C/W) R
JC
(C/W)
Figure 6-31
ZCN Pkg. 1.6 24.58 10.81 - 2S2P
ZER Pkg. 1.6 15.8 6 6 2S2P
(1) R
JA
(Theta-JA) = Thermal Resistance Junction-to-Ambient, C/W
R
JB
(Theta-JB) = Thermal Resistance Junction-to-Board, C/W
R
JC
(Theta-JC) = Thermal Resistance Junction-to-Case, C/W
7.2 Device Support
7.2.1 Device and Development-Support Tool Nomenclature
To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all
AM3517/05 microprocessors and support tools. Each device has one of three prefixes: X, P, or null (no
prefix). Texas Instruments recommends two of three possible prefix designators for its support tools:
TMDX and TMDS. These prefixes represent evolutionary stages of product development from engineering
prototypes (TMDX) through fully qualified production devices/tools (TMDS).
Device development evolutionary flow:
X Experimental device that is not necessarily representative of the final devices electrical
specifications and may not use production assembly flow. (TMX definition)
P Prototype device that is not necessarily the final silicon die and may not necessarily meet
final electrical specifications. (TMP definition)
null Production version of the silicon die that is fully qualified. (TMS definition)
Support tool development evolutionary flow:
TMDX Development support product that has not yet completed Texas Instruments internal
qualification testing.
TMDS Fully qualified development support product.
TMX and TMP devices and TMDX development-support tools are shipped against the following
disclaimer:
Developmental product is intended for internal evaluation purposes.
Production devices and TMDS development-support tools have been characterized fully, and the quality
and reliability of the device have been demonstrated fully. TIs standard warranty applies.
Predictions show that prototype devices (X or P), have a greater failure rate than the standard production
devices. Texas Instruments recommends that these devices not be used in any production system
because their expected end-use failure rate still is undefined. Only qualified production devices are to be
used.
For additional description of the device nomenclature markings, see the AM35x ARM Microprocessor
Silicon Errata (literature number SPRZ306).
Copyright © 2009–2013, Texas Instruments Incorporated Package Characteristics 215
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