Datasheet
Table Of Contents
- FEATURES
- APPLICATIONS
- DESCRIPTION
- ABSOLUTE MAXIMUM RATINGS
- THERMAL INFORMATION
- REGULATORY INFORMATION
- IEC 60747-5-2 INSULATION CHARACTERISTICS
- IEC SAFETY LIMITING VALUES
- IEC 61000-4-5 RATINGS
- IEC 60664-1 RATINGS
- PACKAGE CHARACTERISTICS
- ELECTRICAL CHARACTERISTICS
- PIN CONFIGURATIONS
- TYPICAL CHARACTERISTICS
- THEORY OF OPERATION
- APPLICATION INFORMATION
- ISOLATION GLOSSARY
- REVISION HISTORY
Top View
Clearance area.
Keep free of any
conductive materials.
AMC1200
AMC1200B
LEGEND
Top layer; copper pour and traces
High-side area
Controller-side area
Via
To Shunt
To Filter or ADC
VDD1
VINP
GND1
VINN
VDD2
VOUTP
VOUTN
GND2
0.1mF
SMD
1206
0.1 F
SMD
1206
m
0.1 F
SMD
1206
m
330 pF
SMD
0603
12
SMD 0603
W
12
SMD 0603
W
AMC1200
AMC1200B
www.ti.com
SBAS542C –APRIL 2011–REVISED SEPTEMBER 2013
Figure 33. Layout Recommendation
To maintain the isolation barrier and the high CMTI of the device, the distance between the high-side ground (GND1) and the low-side ground (GND2)
should be kept at maximum; that is, the entire area underneath the device should be kept free of any conducting materials.
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