Datasheet

DEVICE INFORMATION
CVDD
IN1
CLK1
IN2
CLK2
IN3
CLK3
IN4
CLK4
AVDD
BVDD
GND
AD0
AD1
AD2
AD3
AD4
AD5
AD6
AD7
1
2
3
4
5
6
7
8
9
10
30
29
28
27
26
25
24
23
22
21
AMC1210
PWM1
GND
11
40
12
39
PWM2
DVDD
AGND
TE
DVDD
RST
GND
M1
CLK
M0
SH1
ALE
SH2
CS
ACK
RD
INT
WR
13
38
14
37
15
36
16
35
17
34
18
33
19
32
20
31
AMC1210
SBAS372D – APRIL 2006 – REVISED MAY 2009 .............................................................................................................................................................. www.ti.com
RHA PACKAGE
(1)
QFN-40
(TOP VIEW)
(1) The thermal pad is internally connected to the substrate. This pad can be connected to the analog ground or left
floating. Keep the thermal pad separate from the digital ground, if possible.
4 Submit Documentation Feedback Copyright © 2006 – 2009, Texas Instruments Incorporated
Product Folder Link(s): AMC1210