Datasheet

ManualsBrandsTEXAS INSTRUMENTS ManualsPMICsPMIC - battery management Charge management Li-Ion HTSSOP 20 Surface-mount

bq24004

bq24005

bq24006

www.ti.com

SLUS476F –DECEMBER 2000–REVISED MAY 2012

TWO-CELL Li-ION CHARGE MANAGEMENT IC

FOR PDAs AND INTERNET APPLIANCES

Check for Samples: bq24004, bq24005, bq24006

FEATURES

DESCRIPTION

• Highly Integrated Solution With FET Pass

The bq2400x series ICs are advanced Li-Ion linear

Transistor and Reverse-Blocking Schottky and

charge management devices for highly integrated and

Thermal Protection

space-limited applications. They combine high-

• Integrated Voltage and Current Regulation

accuracy current and voltage regulation; FET pass-

With Programmable Charge Current

transistor and reverse-blocking Schottky; battery

conditioning, temperature, or input-power monitoring;

• High-Accuracy Voltage Regulation (±1%)

charge termination; charge-status indication; and

• Ideal for Low-Dropout Linear Charger Designs

charge timer in a small package.

for Two-Cell Li-Ion Packs With Coke or

Graphite Anodes The bq2400x measures battery temperature using an

external thermistor. For safety, the bq2400x inhibits

• Up to 1.2-A Continuous Charge Current

charge until the battery temperature is within the

• Safety-Charge Timer During Preconditioning

user-defined thresholds. Alternatively, the user can

and Fast Charge

monitor the input voltage to qualify charge. The

bq2400x series then charge the battery in three

• Integrated Cell Conditioning for Reviving

phases: preconditioning, constant current, and

Deeply Discharged Cells and Minimizing Heat

constant voltage. If the battery voltage is below the

Dissipation During Initial Stage of Charge

internal low-voltage threshold, the bq2400x uses low-

• Optional Temperature or Input-Power

current precharge to condition the battery. A

Monitoring Before and During Charge

preconditioning timer provides additional safety.

• Various Charge-Status Output Options for

Following pre- conditioning, the bq2400x applies a

Driving Single, Double, or Bicolor LEDs or constant-charge current to the battery. An external

sense-resistor sets the magnitude of the current. The

Host-Processor Interface

constant-current phase is maintained until the battery

• Charge Termination by Minimum Current and

reaches the charge-regulation voltage. The bq2400x

Time

then transitions to the constant voltage phase. The

• Low-Power Sleep Mode

user can configure the device for cells with either

coke or graphite anodes. The accuracy of the voltage

• Packaging: 20-Lead TSSOP PowerPAD™

regulation is better than ±1% over the operating

junction temperature and supply voltage range.

APPLICATIONS

Charge is terminated by maximum time or minimum

• PDAs

taper current detection

• Internet Appliances

The bq2400x automatically restarts the charge if the

• MP3 Players

battery voltage falls below an internal recharge

• Digital Cameras

threshold.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2PowerPAD is a trademark of Texas Instruments.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (27 pages)

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bq24004 bq24005 bq24006 www.ti.
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bq24004 bq24005 bq24006 SLUS476F – DECEMBER 2000 – REVISED MAY 2012 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
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bq24004 bq24005 bq24006 www.ti.com SLUS476F – DECEMBER 2000 – REVISED MAY 2012 ELECTRICAL CHARACTERISTICS over recommended operating junction temperature supply and input voltages, and VI (VCC) ≥ VI (IN) ( unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP EN ≤ V(IHEN) MAX VCC current VCC > VCC_UVLO, VCC current, standby mode EN ≤ V(ILEN) 1 IN current, standby mode EN ≤ V(ILEN) Standby current (sum of currents into OUT and VSENSE pins) VCC < VCC_UVLO, VO(OUT) = 8.6 V, VSENSE = 8.
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bq24004 bq24005 bq24006 SLUS476F – DECEMBER 2000 – REVISED MAY 2012 www.ti.com ELECTRICAL CHARACTERISTICS (continued) over recommended operating junction temperature supply and input voltages, and VI (VCC) ≥ VI (IN) ( unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT VSEL LOGIC INPUT, 0°C ≤ TJ ≤ 125°C High-level input voltage 2.25 V Low-level input voltage Input pulldown resistance 100 0.8 V 200 kΩ TMR SEL INPUT 0°C ≤ TJ ≤ 125°C High-level input voltage 2.
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bq24004 bq24005 bq24006 www.ti.
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bq24004 bq24005 bq24006 SLUS476F – DECEMBER 2000 – REVISED MAY 2012 www.ti.com FUNCTIONAL BLOCK DIAGRAM OUT IN + VSENSE TaperDet - V(ilim) VCC + - ISNS + 0.2*V(ilim) V(ref) AGND + ChargeOK UVS Precharge - GND/ HEATSINK LowV V(uvlo) OverV + Bias and Ref Generator HighV + V(ref) V(uvlo) LowV ChipEN - EN VSEL R8 + Power On Delay APG/ THERM + - R9 - H: V(reg) = 8.4 V/Cell L: V(reg) = 8.
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bq24004 bq24005 bq24006 www.ti.com SLUS476F – DECEMBER 2000 – REVISED MAY 2012 TYPICAL CHARACTERISTICS OUTPUT VOLTAGE vs OUTPUT CURRENT OUTPUT VOLTAGE vs JUNCTION TEMPERATURE V(IN) = 10 V o TA = 25 C TJ - Junction Temperature - oC Figure 1. Figure 2. OUTPUT VOLTAGE vs INPUT VOLTAGE CURRENT SENSE VOLTAGE vs INPUT VOLTAGE IO = 100 mA TA = 25oC IO = 100 mA o TA = 25 C Figure 3. Figure 4.
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bq24004 bq24005 bq24006 SLUS476F – DECEMBER 2000 – REVISED MAY 2012 www.ti.com TYPICAL CHARACTERISTICS (continued) CURRENT SENSE VOLTAGE vs JUNCTION TEMPERATURE VCC = 10 V IO = 100 mA o TA = 25 C QUIESCENT CURRENT vs INPUT VOLTAGE TA = 25oC TJ - Junction Temperature - oC Figure 5. Figure 6. QUIESCENT CURRENT (POWER DOWN) vs INPUT VOLTAGE DROPOUT VOLTAGE vs INPUT VOLTAGE o TA = 25oC TA = 25 C Figure 7. 8 Submit Documentation Feedback Figure 8.
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bq24004 bq24005 bq24006 www.ti.com SLUS476F – DECEMBER 2000 – REVISED MAY 2012 TYPICAL CHARACTERISTICS (continued) DROPOUT VOLTAGE vs OUTPUT CURRENT DROPOUT VOLTAGE vs JUNCTION TEMPERATURE VCC = 10 V o TA = 25 C o TJ - Junction Temperature - C Figure 9. Figure 10. REVERSE CURRENT vs JUNCTION TEMPERATURE REVERSE CURRENT LEAKAGE vs VOLTAGE ON OUT PIN o IR - Reverse Current - mA IR - Reverse Current Leakage - mA TA = 25 C o TJ - Junction Temperature - C Figure 11. Figure 12.
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bq24004 bq24005 bq24006 SLUS476F – DECEMBER 2000 – REVISED MAY 2012 www.ti.com APPLICATION INFORMATION U1 VCC 1 R1 0.1 Ω 2 DC+ C1 10 µF + VCC 3 4 DC- 5 6 C2 0.1 µF 7 8 9 10 N/C IN N/C OUT IN OUT VCC ISNS VSENSE AGND N/C STAT2 APG/THM STAT1 EN TMR SEL VSEL GND CR N/C 20 19 PACK+ 18 + 17 - 16 PACK- 15 C4 1 µF 14 13 TEMP 12 11 VCC C3 0.22 µF Battery Pack R4 500 Ω bq24005PWP D1 R5 500 Ω R2 18.7 kΩ D2 R3 95.3 kΩ Figure 13.
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bq24004 bq24005 bq24006 www.ti.com SLUS476F – DECEMBER 2000 – REVISED MAY 2012 Current Regulation Phase Preconditioning Phase Voltage Regulation and Charge Termination Phase Regulation Voltage V(OUT) Regulation Current I(lim) Charge Voltage Minimum Charge Voltage V(LOWV) Preconditioning Current I(PRECHG) Charge Current Taper Detect 22.5 Minutes 22.5 Minutes Charge Timer (3, 4.5 or 6 Hours) Figure 14.
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bq24004 bq24005 bq24006 SLUS476F – DECEMBER 2000 – REVISED MAY 2012 www.ti.com POR Yes V I(VSENSE) < V(LOWV)? Regulate I (PRECHG) Reset and Start 22.5 min T imer Indicate PreCharge No Reset All Timers, Start Charge T imer (TMR SEL Input) Yes VI(VSENSE) > V(OVERV)? No Regulate Current or Voltage Indicate Charge No V I(VSENSE) < V(LOWV)? Yes VI(VSENSE) > V(OVERV)? Yes 22.
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bq24004 bq24005 bq24006 www.ti.com SLUS476F – DECEMBER 2000 – REVISED MAY 2012 Charge Qualification and Preconditioning The APG/THERM input can also be configured to monitor either the adapter power or the battery temperature using a thermistor. The bq2400x suspends charge if this input is outside the limits set by the user. Refer to the APG/THERM input section for additional details. The bq2400x starts a charge cycle when power is applied while a battery is present.
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bq24004 bq24005 bq24006 SLUS476F – DECEMBER 2000 – REVISED MAY 2012 www.ti.com If the charger designs incorporate a thermistor, the resistor divider RT1 and RT2 is calculated by using the following two equations. First, calculate RT2. V B RH R C RT2 + RH ǒ V V B H Ǔ ƪ 1 V C 1 * * 1 * RC ǒ V V ƫ V H B C Ǔ * 1 then use the resistor value to find RT1.
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bq24004 bq24005 bq24006 www.ti.com SLUS476F – DECEMBER 2000 – REVISED MAY 2012 U1 VCC 1 R(SNS) 2 DC+ C1 10 µF + VCC 3 4 DC- 5 6 C2 0.1 µF 7 8 9 10 N/C N/C IN OUT IN OUT VCC VSENSE ISNS AGND N/C STAT2 APG/THM STAT1 EN TMR SEL VSEL CR GND N/C 20 19 18 17 16 15 14 13 12 11 bq24005PWP Figure 19. Current Sensing Circuit Charge current feedback, applied through pin ISNS, maintains regulation around a threshold of Vilim.
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bq24004 bq24005 bq24006 SLUS476F – DECEMBER 2000 – REVISED MAY 2012 www.ti.com Table 1. bq24004 (Single LED) (continued) CHARGE STATE STAT1 Done (>90%) OFF (HIGH) Sleep-mode OFF (HIGH) APG/Therm invalid OFF (HIGH) Thermal shutdown OFF (HIGH) Battery absent OFF (HIGH) Table 2. bq24005 (2 Individual LEDs) (continued) CHARGE STATE OFF(1) If thermistor is used, then the Green LED is off. Table 3.
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bq24004 bq24005 bq24006 www.ti.com SLUS476F – DECEMBER 2000 – REVISED MAY 2012 THERMAL INFORMATION THERMALLY ENHANCED TSSOP-20 DIE The thermally enhanced PWP package is based on the 20-pin TSSOP, but includes a thermal pad (seeFigure 20) to provide an effective thermal contact between the IC and the PWB. Side View (a) DIE Traditionally, surface mount and power have been mutually exclusive terms.
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bq24004 bq24005 bq24006 SLUS476F – DECEMBER 2000 – REVISED MAY 2012 www.ti.com THERMAL RESISTANCE vs COPPER HEAT-SINK AREA 150 Natural Convection R θ JA - Thermal Resistance - ° C/W 125 50 ft/min 100 ft/min 100 150 ft/min 200 ft/min 75 50 250 ft/min 300 ft/min 25 0 0.3 1 2 3 4 5 6 7 8 Copper Heat-Sink Area - cm2 Figure 21.
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bq24004 bq24005 bq24006 www.ti.com SLUS476F – DECEMBER 2000 – REVISED MAY 2012 3.5 3.5 TA = 25°C TA = 55°C 300 ft/min 3 PD - Power Dissipation Limit - W PD - Power Dissipation Limit - W 3 150 ft/min 2.5 2 Natural Convection 1.5 1 0.5 0 300 ft/min 2.5 2 150 ft/min 1.5 Natural Convection 1 0.5 0 0.3 2 4 0 8 6 Copper Heat-Sink Size - cm2 0 0.3 2 4 6 8 Copper Heat-Sink Size - cm2 (a) (b) 3.5 TA = 105°C PD - Power Dissipation Limit - W 3 2.5 2 1.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.com 22-May-2012 Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
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PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) BQ24004PWPR HTSSOP PWP 20 2000 330.0 16.4 BQ24005PWPR HTSSOP PWP 20 2000 330.0 BQ24006PWPR HTSSOP PWP 20 2000 330.0 6.95 7.1 1.6 8.0 16.0 Q1 16.4 6.95 7.1 1.6 8.0 16.0 Q1 16.4 6.95 7.1 1.6 8.0 16.
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PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) BQ24004PWPR HTSSOP PWP 20 2000 367.0 367.0 38.0 BQ24005PWPR HTSSOP PWP 20 2000 367.0 367.0 38.0 BQ24006PWPR HTSSOP PWP 20 2000 367.0 367.0 38.
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IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.