Datasheet

bq24070
bq24071
www.ti.com SLUS694F –MARCH 2006–REVISED DECEMBER 2009
ABSOLUTE MAXIMUM RATINGS
(1)
over operating free-air temperature range (unless otherwise noted)
bq24070/1
Input voltage IN (DC voltage with respect to VSS) –0.3 V to 18 V
BAT, CE, DPPM, PG, Mode, OUT, ISET1, ISET2, STAT1,
–0.3 V to 7 V
STAT2, TS, (all DC voltages wrt VSS)
Input voltage
V
REF
(DC voltage wrt VSS) –0.3 V to V
O(OUT)
+ 0.3 V
TMR –0.3 V to V
O
+ 0.3 V
Input current 3.5 A
OUT 4 A
Output current
BAT
(2)
–4 A to 3.5 A
Output source current (in
V
REF
30 mA
regulation at 3.3 V V
REF
)
Output sink current PG, STAT1, STAT2, 15 mA
Storage temperature range, T
stg
–65°C to 150°C
Junction temperature range, T
J
–40°C to 150°C
Lead temperature (soldering, 10 seconds) 300°C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage
values are with respect to the network ground terminal unless otherwise noted.
(2) Negative current is defined as current flowing into the BAT pin.
RECOMMENDED OPERATING CONDITIONS
MIN MAX UNIT
V
CC
Supply voltage (V
IN
)
(1)
4.35 16 V
I
AC
Input current 2 A
T
J
Operating junction temperature range –40 125 °C
(1) Verify that power dissipation and junction temperatures are within limits at maximum V
CC
.
DISSIPATION RATINGS
T
A
≤ 40°C DERATING FACTOR
PACKAGE θ
JA
POWER RATING T
A
> 40°C
20-pin RHL
(1)
1.81 W 21 mW/°C 46.87 °C/W
(1) This data is based on using the JEDEC High-K board and the exposed die pad is connected to a Cu pad on the board. This is
connected to the ground plane by a 2×3 via matrix.
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