Datasheet

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PCB Layout Guidelines:
bq24314
bq24316
SLUS763C – JULY 2007 – REVISED OCTOBER 2007
• This device is a protection device, and is meant to protect down-stream circuitry from hazardous voltages.
Potentially, high voltages may be applied to this IC. It has to be ensured that the edge-to-edge clearances of
PCB traces satisfy the design rules for high voltages.
• The device uses SON packages with a PowerPAD™. For good thermal performance, the PowerPAD should
be thermally coupled with the PCB ground plane. In most applications, this will require a copper pad directly
under the IC. This copper pad should be connected to the ground plane with an array of thermal vias.
• C
IN
and C
OUT
should be located close to the IC. Other components like R
ILIM
and R
BAT
should also be located
close to the IC.
Copyright © 2007, Texas Instruments Incorporated Submit Documentation Feedback 15
Product Folder Link(s): bq24314 bq24316