Datasheet

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TERMINAL FUNCTIONS
NC
VSS
FAULT
IN
OUT
CE
1
2
3
6
8
7
4
5
VBAT
ILIM
bq24314DSG
bq24316DSG
FAULT
NC
VSS
CE
3
4
5
8
10
9
6
7
VBAT
ILIM
2
IN
1
NC
12
OUT
11
bq24314DSJ
bq24316DSJ
IN
NC
OUT
bq24314
bq24316
SLUS763C – JULY 2007 – REVISED OCTOBER 2007
TERMINAL
I/O DESCRIPTION
NAME DSJ DSG
1, 2 1 I Input power, connect to external DC supply. Connect external 1 μ F ceramic capacitor (minimum) to
IN VSS. For the 12 pin (DSJ-suffix) device, ensure that pins 1 and 2 are connected together on the
PCB at the device.
OUT 10, 11 8 O Output terminal to the charging system. Connect external 1 μ F ceramic capacitor (minimum) to VSS.
VBAT 8 6 I Battery voltage sense input. Connect to pack positive terminal through a resistor.
9 7 I/O Input overcurrent threshold programming. Connect a resistor to VSS to set the overcurrent
ILIM
threshold.
CE 7 5 I Chip enable input. Active low. When CE = High, the input FET is off. Internally pulled down.
Open-drain output, device status. FAULT = Low indicates that the input FET Q1 has been turned off
FAULT 4 4 O
due to input overvoltage, input overcurrent, battery overvoltage, or thermal shutdown.
VSS 3 2 – Ground terminal
These pins may have internal circuits used for test purposes. Do not make any external connections
NC 5, 6, 12 3
at these pins for normal operation.
There is an internal electrical connection between the exposed thermal pad and the VSS pin of the
Thermal device. The thermal pad must be connected to the same potential as the VSS pin on the printed
–
PAD circuit board. Do not use the thermal pad as the primary ground input for the device. The VSS pin
must be connected to ground at all times.
Copyright © 2007, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Link(s): bq24314 bq24316