Datasheet

ManualsBrandsTEXAS INSTRUMENTS ManualsPMICsPMIC - battery management Surge/undervoltage protection Li-Ion WSON 8 (2x2) Surface-mount

FEATURES

APPLICATIONS

DESCRIPTION

AC Adapter

VDC

GND

1 Fm

bq24316DSG

bq24080

ChargerIC

SYSTEM

OUT

VBAT

FAULT

VSS

ILIM

1 Fm

APPLICATIONSCHEMATIC

bq24314

bq24316

SLUS763C – JULY 2007 – REVISED OCTOBER 2007

www.ti.com

OVERVOLTAGE AND OVERCURRENT PROTECTION IC AND

Li+ CHARGER FRONT-END PROTECTION IC

• Available in Space-Saving Small 8 Lead 2 × 2

SON and 12 Lead 4x3 SON Packages

• Provides Protection for Three Variables:

– Input Overvoltage, with Rapid Response in

< 1 μ s

• Mobile Phones and Smart Phones

– User-Programmable Overcurrent with

• PDAs

Current Limiting

• MP3 Players

– Battery Overvoltage

• Low-Power Handheld Devices

• 30V Maximum Input Voltage

• Bluetooth Headsets

• Supports up to 1.5A Input Current

• Robust Against False Triggering Due to

Current Transients

• Thermal Shutdown

• Enable Input

• Status Indication – Fault Condition

The bq24314 and bq24316 are highly integrated circuits designed to provide protection to Li-ion batteries from

failures of the charging circuit. The IC continuously monitors the input voltage, the input current, and the battery

voltage. In case of an input overvoltage condition, the IC immediately removes power from the charging circuit by

turning off an internal switch. In the case of an overcurrent condition, it limits the system current at the threshold

value, and if the overcurrent persists, switches the pass element OFF after a blanking period. Additionally, the IC

also monitors its own die temperature and switches off if it becomes too hot. The input overcurrent threshold is

user-programmable.

The IC can be controlled by a processor and also provides status information about fault conditions to the host.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2 PowerPAD is a trademark of Texas Instruments.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (26 pages)

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bq24314 bq24316 www.ti.com SLUS763C – JULY 2007 – REVISED OCTOBER 2007 OVERVOLTAGE AND OVERCURRENT PROTECTION IC AND Li+ CHARGER FRONT-END PROTECTION IC • FEATURES 1 • Provides Protection for Three Variables: – Input Overvoltage, with Rapid Response in < 1 μs – User-Programmable Overcurrent with Current Limiting – Battery Overvoltage • 30V Maximum Input Voltage • Supports up to 1.
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bq24314 bq24316 www.ti.com SLUS763C – JULY 2007 – REVISED OCTOBER 2007 These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ORDERING INFORMATION (1) DEVICE (2) OVP THRESHOLD PACKAGE MARKING bq24314DSG 5.85 V 2mm x 2mm SON CBV bq24314DSJ 5.85 V 4mm x 3mm SON CBX bq24316DSG 6.80 V 2mm x 2mm SON CBW bq24316DSJ 6.
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bq24314 bq24316 www.ti.com SLUS763C – JULY 2007 – REVISED OCTOBER 2007 ELECTRICAL CHARACTERISTICS over junction temperature range 0°C ≤ TJ ≤ 125°C and recommended supply voltage (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT IN VUVLO Under-voltage lock-out, input power detected threshold CE = Low, VIN increasing from 0V to 3V 2.6 2.7 2.
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bq24314 bq24316 www.ti.com SLUS763C – JULY 2007 – REVISED OCTOBER 2007 Q1 IN Charge Pump, Bandgap, Bias Gen OUT VBG ISNS ILIM ILIMREF Current limiting loop OFF OCP comparator ILIMREF - Δ t BLANK(OCP) ISNS FAULT VIN VBG COUNTERS, CONTROL, AND STATUS OVP VIN CE VBG t DGL(PGOOD) UVLO VBAT THERMAL SHUTDOW VBG t DGL(BOVP) VSS Figure 1.
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bq24314 bq24316 www.ti.com SLUS763C – JULY 2007 – REVISED OCTOBER 2007 TERMINAL FUNCTIONS TERMINAL NAME I/O DESCRIPTION DSJ DSG 1, 2 1 I Input power, connect to external DC supply. Connect external 1μF ceramic capacitor (minimum) to VSS. For the 12 pin (DSJ-suffix) device, ensure that pins 1 and 2 are connected together on the PCB at the device. OUT 10, 11 8 O Output terminal to the charging system. Connect external 1μF ceramic capacitor (minimum) to VSS.
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bq24314 bq24316 www.ti.com SLUS763C – JULY 2007 – REVISED OCTOBER 2007 TYPICAL OPERATING PERFORMANCE Test conditions (unless otherwise noted) for typical operating performance: VIN = 5 V, CIN = 1 μF, COUT = 1 μF, RILIM = 25 kΩ, RBAT = 100 kΩ, TA = 25°C, VPU = 3.3V (see Figure 23 for the Typical Application Circuit) VIN VIN VOUT VOUT IOUT FAULT Figure 2. Normal Power-On Showing Soft-Start, ROUT = 6.6Ω Figure 3. OVP at Power-On, VIN = 0V to 9V, tr = 50μs VIN VIN Max VOUT = 6.84 V Max VOUT = 6.
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bq24314 bq24316 www.ti.com SLUS763C – JULY 2007 – REVISED OCTOBER 2007 TYPICAL OPERATING PERFORMANCE (continued) VIN VIN VOUT IOUT IOUT VOUT FAULT FAULT Figure 8. Recovery from OVP, VIN = 7.5V to 5V, tf = 400μs Figure 9. OCP, Powering Up into a Short Circuit on OUT Pin, OCP Counter Counts to 15 Before Switching OFF the Device VIN VIN VOUT IOUT IOUT VOUT FAULT FAULT Figure 10. OCP, Zoom-in on the First Cycle of Figure 9 Figure 11. OCP, ROUT Switches from 6.6Ω to 3.
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bq24314 bq24316 www.ti.com SLUS763C – JULY 2007 – REVISED OCTOBER 2007 TYPICAL OPERATING PERFORMANCE (continued) UNDERVOLTAGE LOCKOUT vs FREE-AIR TEMPERATURE DROPOUT VOLTAGE (IN to OUT) vs FREE-AIR TEMPERATURE 280 2.75 260 2.7 VIN Increasing 240 VIN = 4 V 220 VDO @ 1A - mV VUVLO, VHYS-UVLO - V 2.65 2.6 2.55 200 VIN = 5 V 180 160 2.5 140 VIN Decreasing 2.45 2.4 -50 120 100 -30 -10 10 30 50 70 Temperature - °C 90 110 0 130 50 100 150 Temperature - °C Figure 14. Figure 15.
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bq24314 bq24316 www.ti.com SLUS763C – JULY 2007 – REVISED OCTOBER 2007 TYPICAL OPERATING PERFORMANCE (continued) BATTERY OVERVOLTAGE PROTECTION vs FREE-AIR TEMPERATURE LEAKAGE CURRENT (VBAT Pin) vs FREE-AIR TEMPERATURE 4.4 2.5 4.35 BVOVP (VVBAT Increasing) 2 1.5 4.25 IVBAT - nA BVOVP - V 4.3 4.2 1 4.15 0.5 4.1 4.05 -50 Bat-OVP Recovery (VVBAT Decreasing) -30 -10 10 30 50 70 Temperature - °C 90 110 0 -50 130 -30 -10 10 Figure 20.
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bq24314 bq24316 www.ti.com SLUS763C – JULY 2007 – REVISED OCTOBER 2007 TYPICAL APPLICATION CIRCUIT VOVP = 6.8V, IOCP = 1000mA, BVOVP = 4.35V (Terminal numbers shown are for the 2×2 DSG package) AC Adapter VDC 1 IN OUT 8 CIN GND COUT 1 mF 1 mF bq24080 Charger IC bq24316DSG RBAT SYSTEM VBAT 6 100 kW VPU RPU 47 kW 47 kW FAULT 4 RFAULT ILIM VSS 47 kW 7 2 CE 5 Host Controller RCE RILM 25 kW Figure 23.
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bq24314 bq24316 www.ti.com SLUS763C – JULY 2007 – REVISED OCTOBER 2007 OPERATION The device continuously monitors the input voltage, the input current, and the battery voltage as described in detail in the following sections. Input Overvoltage Protection If the input voltage rises above VOVP, the internal FET Q1 is turned off, removing power from the circuit. As shown in Figure 4 to Figure 7, the response is very rapid, with the FET turning off in less than a microsecond. The FAULT pin is driven low.
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bq24314 bq24316 www.ti.
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bq24314 bq24316 www.ti.com SLUS763C – JULY 2007 – REVISED OCTOBER 2007 APPLICATION INFORMATION (WITH REFERENCE TO FIGURE 23) Selection of RBAT It is strongly recommended that the battery not be tied directly to the VBAT pin of the device, as under some failure modes of the IC, the voltage at the IN pin may appear on the VBAT pin. This voltage can be as high as 30V, and applying 30V to the battery in case of the failure of the bq2431x can be hazardous.
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bq24314 bq24316 www.ti.com SLUS763C – JULY 2007 – REVISED OCTOBER 2007 Accessory power supply IN AC Adapter OUT Charger bq24316 e.g. cellphone DIS EN Battery pack to rest of system Figure 25. Charging - The Red Arrows Show the Direction of Current Flow IN OUT Charger bq24316 e.g. cellphone EN Accessory power supply DIS Battery pack to rest of system Figure 26.
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bq24314 bq24316 www.ti.com SLUS763C – JULY 2007 – REVISED OCTOBER 2007 PCB Layout Guidelines: • • • This device is a protection device, and is meant to protect down-stream circuitry from hazardous voltages. Potentially, high voltages may be applied to this IC. It has to be ensured that the edge-to-edge clearances of PCB traces satisfy the design rules for high voltages. The device uses SON packages with a PowerPAD™.
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bq24314 bq24316 www.ti.com SLUS763C – JULY 2007 – REVISED OCTOBER 2007 Revision History Changes from Revision B (September 2007) to Revision C .......................................................................................... Page • • 16 Changed bq24314DSJ marking from preview to CBX .......................................................................................................... 2 Changed bq24316DSJ marking from preview to BZC...........................................................
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.
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PACKAGE MATERIALS INFORMATION www.ti.com 26-Jan-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing BQ24314DSGR WSON DSG 8 BQ24314DSGT WSON DSG BQ24314DSJR VSON DSJ BQ24314DSJT VSON DSJ BQ24316DSGR WSON DSG BQ24316DSGT WSON DSG BQ24316DSJR VSON DSJ BQ24316DSJT VSON DSJ 12 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 3000 179.0 8 250 12 3000 12 8 B0 (mm) K0 (mm) P1 (mm) 8.4 2.2 2.2 1.2 4.0 179.0 8.4 2.
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PACKAGE MATERIALS INFORMATION www.ti.com 26-Jan-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) BQ24314DSGR WSON DSG 8 3000 195.0 200.0 45.0 BQ24314DSGT WSON DSG 8 250 195.0 200.0 45.0 BQ24314DSJR VSON DSJ 12 3000 367.0 367.0 35.0 BQ24314DSJT VSON DSJ 12 250 210.0 185.0 35.0 BQ24316DSGR WSON DSG 8 3000 195.0 200.0 45.0 BQ24316DSGT WSON DSG 8 250 195.0 200.0 45.
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IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.