Datasheet
bq29330
SLUS673E –SEPTEMBER 2005–REVISED MARCH 2012
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
DESCRIPTION (CONTINUED)
The bq29330 provides safety protection for overload, short circuit in charge, and short circuit in discharge
conditions and can also provide cell overvoltage, battery overvoltage and battery undervoltage protection with the
battery management host. In overload, short circuit in charge and short circuit in discharge conditions, the
bq29330 turns off the FET drive autonomously, depending on the internal configuration setting. The
communications interface allows the host to observe and control the status of the bq29330, enable cell
balancing, enter different power modes, set current protection levels, and set the blanking delay times.
Cell balancing of each cell can be performed via a cell bypass path integrated into the bq29330, which can be
enabled via the internal control register accessible via the I
2
C-compatible interface. The maximum bypass current
is set via an external series resistor and internal FET on resistance (typ. 400 Ω).
ORDERING INFORMATION
(1)
PACKAGE
T
A
TSSOP(DBT)
(2)
QFN(RSM)
(2)
–40°C to 110°C bq29330DBT bq29330RSM
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
(2) The bq29330 can be ordered in tape and reel by adding the suffix R to the orderable part number, i.e., bq29330DBTR.
SPACER
THERMAL INFORMATION
bq29330
THERMAL METRIC
(1)
TSSOP (DBT) QFN (RSM) UNITS
30 PINS 32 PINS
θ
JA, High K
Junction-to-ambient thermal resistance 81.4 37.4
θ
JC(top)
Junction-to-case(top) thermal resistance 16.2 30.6
θ
JB
Junction-to-board thermal resistance 34.1 7.7
°C/W
ψ
JT
Junction-to-top characterization parameter 0.4 0.4
ψ
JB
Junction-to-board characterization parameter 33.6 7.5
θ
JC(bottom)
Junction-to-case(bottom) thermal resistance N/A 2.6
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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