Data Sheet
Table Of Contents
- 1 Module Overview
- Table of Contents
- 2 Revision History
- 3 Device Comparison
- 4 Terminal Configuration and Functions
- 5 Specifications
- 5.1 Absolute Maximum Ratings
- 5.2 ESD Ratings
- 5.3 Recommended Operating Conditions
- 5.4 Current Consumption Summary: 2.4 GHz RF Band
- 5.5 Current Consumption Summary: 5 GHz RF Band
- 5.6 TX Power Control for 2.4 GHz Band
- 5.7 TX Power Control for 5 GHz Band
- 5.8 Brownout and Blackout Conditions
- 5.9 Electrical Characteristics for DIO Pins
- 5.10 WLAN Receiver Characteristics
- 5.11 WLAN Transmitter Characteristics
- 5.12 BLE and WLAN Coexistence Requirements
- 5.13 Reset Requirement
- 5.14 Thermal Resistance Characteristics for MOB Package
- 5.15 Timing and Switching Characteristics
- 5.16 External Interfaces
- 6 Detailed Description
- 7 Applications, Implementation, and Layout
- 8 Environmental Requirements and SMT Specifications
- 9 Device and Documentation Support
- 10 Mechanical, Packaging, and Orderable Information
- Important Notice
TI Confidential – NDA Restrictions
ADVANCEINFORMATION
26
CC3135MOD
SWRS225A –FEBRUARY 2019–REVISED AUGUST 2019
www.ti.com
Submit Documentation Feedback
Product Folder Links: CC3135MOD
Specifications Copyright © 2019, Texas Instruments Incorporated
(1) The CC3135MOD modules are compatible with TI BLE modules using an external RF switch.
(2) A single antenna configuration is possible using the CC3x35 devices.
(3) For dual antenna configuration antenna placement must be such that isolation between the BLE and WLAN ports is at least 20 dB.
5.12 BLE and WLAN Coexistence Requirements
For proper BLE and WLAN 2.4 GHz radio coexistence, the following requirements must be met.
Table 5-6. BLE/WLAN Coex
(1)
Isolation Requirement
PARAMETER Band MIN TYP MAX UNIT
Port-to-port isolation Dual antenna configuration
(2)
20
(3)
dB
(1) The nRESET pin must be held below 0.6 V for the module to register a reset.
5.13 Reset Requirement
PARAMETER MIN TYP MAX UNIT
V
IH
Operation mode level 0.65 × V
BAT
V
V
IL
Shutdown mode level
(1)
0 0.6 V
Minimum time for nReset low for resetting the module 5 ms
T
r
and T
f
Rise and fall times 20 µs
(1) °C/W = degrees Celsius per watt.
(2) These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RΘ
JC
] value, which is based on a
JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these
EIA/JEDEC standards:
• JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)
• JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements
Power dissipation of 2 W and an ambient temperature of 70ºC is assumed.
(3) m/s = meters per second.
5.14 Thermal Resistance Characteristics for MOB Package
NO. PARAMET
ER
DESCRIPTION °C/W
(1) (2)
AIR FLOW (m/s)
(3)
T1 RΘ
JC
Junction-to-case 11.4 N/A
T2 RΘ
JB
Junction-to-board 8.0 N/A
T3
RΘ
JA
Junction-to-free air 19.1 0
T4
Junction-to-moving air
14.7 1
T5 13.4 2
T6 12.5 3
T7
Ψ
JT
Junction-to-free air 5.4 0
T8
Junction-to-package top
5.8 1
T9 6.1 2
T10 6.5 3
T11
Ψ
JB
Junction-to-free air 6.8 0
T12
Junction-to-board
6.6 1
T13 6.6 2
T14 6.5 3