Data Sheet
Table Of Contents
- 1 Module Overview
- Table of Contents
- 2 Revision History
- 3 Device Comparison
- 4 Terminal Configuration and Functions
- 5 Specifications
- 5.1 Absolute Maximum Ratings
- 5.2 ESD Ratings
- 5.3 Recommended Operating Conditions
- 5.4 Current Consumption Summary: 2.4 GHz RF Band
- 5.5 Current Consumption Summary: 5 GHz RF Band
- 5.6 TX Power Control for 2.4 GHz Band
- 5.7 TX Power Control for 5 GHz Band
- 5.8 Brownout and Blackout Conditions
- 5.9 Electrical Characteristics for DIO Pins
- 5.10 WLAN Receiver Characteristics
- 5.11 WLAN Transmitter Characteristics
- 5.12 BLE and WLAN Coexistence Requirements
- 5.13 Reset Requirement
- 5.14 Thermal Resistance Characteristics for MOB Package
- 5.15 Timing and Switching Characteristics
- 5.16 External Interfaces
- 6 Detailed Description
- 7 Applications, Implementation, and Layout
- 8 Environmental Requirements and SMT Specifications
- 9 Device and Documentation Support
- 10 Mechanical, Packaging, and Orderable Information
- Important Notice
TI Confidential – NDA Restrictions
ADVANCEINFORMATION
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CC3135MOD
SWRS225A –FEBRUARY 2019–REVISED AUGUST 2019
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Environmental Requirements and SMT Specifications Copyright © 2019, Texas Instruments Incorporated
8 Environmental Requirements and SMT Specifications
8.1 Temperature
8.1.1 PCB Bending
The PCB follows IPC-A-600J for PCB twist and warpage < 0.75% or 7.5 mil per inch.
8.2 Handling Environment
8.2.1 Terminals
The product is mounted with motherboard through land-grid array (LGA). To prevent poor soldering, do
not touch the LGA portion by hand.
8.2.2 Falling
The mounted components will be damaged if the product falls or is dropped. Such damage may cause the
product to malfunction.
8.3 Storage Condition
8.3.1 Moisture Barrier Bag Before Opened
A moisture barrier bag must be stored in a temperature of less than 30°C with humidity under 85% RH.
The calculated shelf life for the dry-packed product will be 24 months from the date the bag is sealed.
8.3.2 Moisture Barrier Bag Open
Humidity indicator cards must be blue, < 30%.
8.4 PCB Assembly Guide
The wireless MCU modules are packaged in a substrate base Leadless Quad Flatpack (QFM) package.
Components were mounted onto the substrate with standard SMT process with the additional of a metal
lid covering the top of the module. The module are designed with pull back leads for easy PCB layout and
board mounting.
8.4.1 PCB Land Pattern & Thermal Vias
We recommended a solder mask defined land pattern to provide a consistent soldering pad dimension in
order to obtain better solder balancing and solder joint reliability. PCB land pattern are 1:1 to module
soldering pad dimension. Thermal vias on PCB connected to other metal plane are for thermal dissipation
purpose. It is critical to have sufficient thermal vias to avoid device thermal shutdown. Recommended vias
size are 0.2mm and position not directly under solder paste to avoid solder dripping into the vias.
8.4.2 SMT Assembly Recommendations
The module surface mount assembly operations include:
• Screen printing the solder paste on the PCB
• Monitor the solder paste volume (uniformity)
• Package placement using standard SMT placement equipment
• X-ray pre-reflow check - paste bridging
• Reflow
• X-ray post-reflow check - solder bridging and voids