Data Sheet
Table Of Contents
- 1 Module Overview
- Table of Contents
- 2 Revision History
- 3 Device Comparison
- 4 Terminal Configuration and Functions
- 5 Specifications
- 5.1 Absolute Maximum Ratings
- 5.2 ESD Ratings
- 5.3 Recommended Operating Conditions
- 5.4 Current Consumption Summary: 2.4 GHz RF Band
- 5.5 Current Consumption Summary: 5 GHz RF Band
- 5.6 TX Power Control for 2.4 GHz Band
- 5.7 TX Power Control for 5 GHz Band
- 5.8 Brownout and Blackout Conditions
- 5.9 Electrical Characteristics for DIO Pins
- 5.10 WLAN Receiver Characteristics
- 5.11 WLAN Transmitter Characteristics
- 5.12 BLE and WLAN Coexistence Requirements
- 5.13 Reset Requirement
- 5.14 Thermal Resistance Characteristics for MOB Package
- 5.15 Timing and Switching Characteristics
- 5.16 External Interfaces
- 6 Detailed Description
- 7 Applications, Implementation, and Layout
- 8 Environmental Requirements and SMT Specifications
- 9 Device and Documentation Support
- 10 Mechanical, Packaging, and Orderable Information
- Important Notice
TI Confidential – NDA Restrictions
ADVANCEINFORMATION
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CC3135MOD
www.ti.com
SWRS225A –FEBRUARY 2019–REVISED AUGUST 2019
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Environmental Requirements and SMT SpecificationsCopyright © 2019, Texas Instruments Incorporated
8.4.3 PCB Surface Finish Requirements
A uniform PCB plating thickness is key for high assembly yield. For an electroless nickel immersion gold
finish, the gold thickness should range from 0.05 μm to 0.20 μm to avoid solder joint embrittlement. Using
a PCB with Organic Solderability Preservative (OSP) coating finish is also recommended as an alternative
to Ni-Au.
8.4.4 Solder Stencil
Solder paste deposition using a stencil-printing process involves the transfer of the solder paste through
pre-defined apertures with the application of pressure. Stencil parameters such as aperture area ratio and
the fabrication process have a significant impact on paste deposition. Inspection of the stencil prior to
placement of package is highly recommended to improve board assembly yields.
8.4.5 Package Placement
Packages can be placed using standard pick and place equipment with an accuracy of ±0.05 mm.
Component pick and place systems are composed of a vision system that recognizes and positions the
component and a mechanical system that physically performs the pick and place operation. Two
commonly used types of vision systems are:
• A vision system that locates a package silhouette
• A vision system that locates individual pads on the interconnect pattern
The second type renders more accurate placements but tends to be more expensive and time consuming.
Both methods are acceptable since the parts align due to a self-centering features fo the solder joint
during solder reflow. It is recommended to release the package to 1 to 2 mils into the solder paste or with
minimum force to avoid causing any possible damage to the thinner packages.
8.4.6 Solder Joint Inspection
After surface mount assembly, transmission X-ray should be used for sample monitoring of the solder
attachment process. This identifies defects such as solder bridging, shorts, opens, and voids. It is also
recommended to use side view inspection in addition to X-rays to determine if there are "Hour Glass"
shaped solder and package tilting existing. The "Hour Glass" solder shape is not a reliable joint. 90° mirror
projection can be used for side view inspection.
8.4.7 Rework and Replacement
TI recommends removal of modules by rework station applying a profile similar to the mounting process.
Using a heat gun can sometimes cause damage to the module by overheating.
8.4.8 Solder Joint Voiding
TI recommends to control solder joint voiding to be less than 30% (per IPC-7093). Solder joint voids could
be reduced by baking of components and PCB, minimized solder paste exposure duration, and reflow
profile optimization.
8.5 Baking Conditions
Products require baking before mounting if:
• Humidity indicator cards read > 30%
• Temp < 30°C, humidity < 70% RH, over 96 hours
Baking condition: 90°C, 12–24 hours
Baking times: 1 time