Data Sheet
Table Of Contents
- 1 Module Overview
- Table of Contents
- 2 Revision History
- 3 Device Comparison
- 4 Terminal Configuration and Functions
- 5 Specifications
- 5.1 Absolute Maximum Ratings
- 5.2 ESD Ratings
- 5.3 Recommended Operating Conditions
- 5.4 Current Consumption Summary: 2.4 GHz RF Band
- 5.5 Current Consumption Summary: 5 GHz RF Band
- 5.6 TX Power Control for 2.4 GHz Band
- 5.7 TX Power Control for 5 GHz Band
- 5.8 Brownout and Blackout Conditions
- 5.9 Electrical Characteristics for DIO Pins
- 5.10 WLAN Receiver Characteristics
- 5.11 WLAN Transmitter Characteristics
- 5.12 BLE and WLAN Coexistence Requirements
- 5.13 Reset Requirement
- 5.14 Thermal Resistance Characteristics for MOB Package
- 5.15 Timing and Switching Characteristics
- 5.16 External Interfaces
- 6 Detailed Description
- 7 Applications, Implementation, and Layout
- 8 Environmental Requirements and SMT Specifications
- 9 Device and Documentation Support
- 10 Mechanical, Packaging, and Orderable Information
- Important Notice
TI Confidential – NDA Restrictions
ADVANCEINFORMATION
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CC3135MOD
SWRS225A –FEBRUARY 2019–REVISED AUGUST 2019
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Environmental Requirements and SMT Specifications Copyright © 2019, Texas Instruments Incorporated
(1) For details, refer to the solder paste manufacturer's recommendation.
8.6 Soldering and Reflow Condition
• Heating method: Conventional convection or IR convection
• Temperature measurement: Thermocouple d = 0.1 mm to 0.2 mm CA (K) or CC (T) at soldering
portion or equivalent method
• Solder paste composition: SAC305
• Allowable reflow soldering times: 2 times based on the reflow soldering profile (see Figure 8-1)
• Temperature profile: Reflow soldering will be done according to the temperature profile (see
Figure 8-1)
• Peak temp: 260°C
Figure 8-1. Temperature Profile for Evaluation of Solder Heat Resistance of a Component
(at Solder Joint)
Table 8-1. Temperature Profile
Profile Elements Convection or IR
(1)
Peak temperature range 235 to 240°C typical (260°C maximum)
Pre-heat / soaking (150 to 200°C) 60 to 120 seconds
Time above melting point 60 to 90 seconds
Time with 5°C to peak 30 seconds maximum
Ramp up < 3°C / second
Ramp down < -6°C / second
NOTE
TI does not recommend the use of conformal coating or similar material on the SimpleLink™
module. This coating can lead to localized stress on the WCSP solder connections inside the
module and impact the device reliability. Use caution during the module assembly process to
the final PCB to avoid the presence of foreign material inside the module.