Data Sheet
Table Of Contents
- 1 Module Overview
- Table of Contents
- 2 Revision History
- 3 Device Comparison
- 4 Terminal Configuration and Functions
- 5 Specifications
- 5.1 Absolute Maximum Ratings
- 5.2 ESD Ratings
- 5.3 Recommended Operating Conditions
- 5.4 Current Consumption Summary: 2.4 GHz RF Band
- 5.5 Current Consumption Summary: 5 GHz RF Band
- 5.6 TX Power Control for 2.4 GHz Band
- 5.7 TX Power Control for 5 GHz Band
- 5.8 Brownout and Blackout Conditions
- 5.9 Electrical Characteristics for DIO Pins
- 5.10 WLAN Receiver Characteristics
- 5.11 WLAN Transmitter Characteristics
- 5.12 BLE and WLAN Coexistence Requirements
- 5.13 Reset Requirement
- 5.14 Thermal Resistance Characteristics for MOB Package
- 5.15 Timing and Switching Characteristics
- 5.16 External Interfaces
- 6 Detailed Description
- 7 Applications, Implementation, and Layout
- 8 Environmental Requirements and SMT Specifications
- 9 Device and Documentation Support
- 10 Mechanical, Packaging, and Orderable Information
- Important Notice
TI Confidential – NDA Restrictions
ADVANCEINFORMATION
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CC3135MOD
SWRS225A –FEBRUARY 2019–REVISED AUGUST 2019
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Mechanical, Packaging, and Orderable Information Copyright © 2019, Texas Instruments Incorporated
10 Mechanical, Packaging, and Orderable Information
The following pages include mechanical packaging and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and
revision of this document.
10.1 Mechanical, Land, and Solder Paste Drawings
NOTE
The total height of the module is 2.4 mm.
The weight of the module is 1.8g typical.
NOTE
1. All dimensions are in mm.
2. Solder mask should be the same or 5% larger than the dimension of the pad
3. Solder paste must be the same as the pin for all peripheral pads. For ground pins, make
the solder paste 20% smaller than the pad.