User's Guide
Table Of Contents
- CC3235MODSF SimpleLink™ Wi-Fi® and IoT Solution With MCU LaunchPad™ Hardware
- Table of Contents
- 1 Introduction
- 2 Hardware
- 2.1 Block Diagram
- 2.2 Hardware Features
- 2.2.1 Key Benefits
- 2.2.2 XDS110-Based Onboard Debug Probe
- 2.2.3 Debug Probe Connection: Isolation Jumper Block
- 2.2.4 Application (or "Backchannel") UART
- 2.2.5 JTAG Headers
- 2.2.6 Using the XDS110 Debug Probe with a Different Target
- 2.2.7 Power Connections
- 2.2.8 Reset Pullup Jumper
- 2.2.9 Clocking
- 2.2.10 I2C Connection
- 2.2.11 Sense on Power (SOP)
- 2.2.12 Push-Buttons and LED Indicators
- 2.3 Electrical Characteristics
- 2.4 Antenna Characteristics
- 2.5 BoosterPack™ Header Pin Assignment
- 3 Layout Guidelines
- 4 Operational Setup and Testing
- 5 Development Environment Requirements
- 6 Additional Resources
- 7 Assembly Drawing and Schematics
- Revision History
- Important Notice
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Layout Guidelines
29
SWRU548A–February 2019
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Copyright © 2019, Texas Instruments Incorporated
CC3235MODSF LaunchPad™ Development Kit (LAUNCHCC3235MOD)
3 Layout Guidelines
The integrator of the CC3235MODx modules must comply with the PCB layout recommendations
described in the following subsections to preserve and minimize the risk with regulatory certifications for
FCC, ISED/IC, ETSI/CE, and MIC. Also, TI recommends that customers follow the guidelines described in
this section to achieve similar performance.
3.1 LAUNCHCC3235MOD Board Layout
The reference layout consists of a four-layer design. Figure 16 shows the LAUNCHCC3235MOD top layer.
Figure 16. LAUNCHCC3235MOD Top Layer