User's Guide
Table Of Contents
- CC3235MODSF SimpleLink™ Wi-Fi® and IoT Solution With MCU LaunchPad™ Hardware
- Table of Contents
- 1 Introduction
- 2 Hardware
- 2.1 Block Diagram
- 2.2 Hardware Features
- 2.2.1 Key Benefits
- 2.2.2 XDS110-Based Onboard Debug Probe
- 2.2.3 Debug Probe Connection: Isolation Jumper Block
- 2.2.4 Application (or "Backchannel") UART
- 2.2.5 JTAG Headers
- 2.2.6 Using the XDS110 Debug Probe with a Different Target
- 2.2.7 Power Connections
- 2.2.8 Reset Pullup Jumper
- 2.2.9 Clocking
- 2.2.10 I2C Connection
- 2.2.11 Sense on Power (SOP)
- 2.2.12 Push-Buttons and LED Indicators
- 2.3 Electrical Characteristics
- 2.4 Antenna Characteristics
- 2.5 BoosterPack™ Header Pin Assignment
- 3 Layout Guidelines
- 4 Operational Setup and Testing
- 5 Development Environment Requirements
- 6 Additional Resources
- 7 Assembly Drawing and Schematics
- Revision History
- Important Notice
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CC3235MODSF LaunchPad™ Development Kit (LAUNCHCC3235MOD)
Figure 23 shows the top view of the coplanar waveguide with GND and via stitching.
Figure 23. CPW With GND and Via Stitching (Top View)
The recommended values for the PCB are provided for 2-layer boards in Table 10 and for 4-layer boards
in Table 11.
Table 10. Recommended PCB Values for 2-Layer Board
(L1 to L2 = 42.1 mils)
PARAMETER VALUE UNIT
W 26 mils
S 5.5 mils
H 42.1 mils
Er (FR-4 substrate) 4.2 F/m
Table 11. Recommended PCB Values for 4-Layer Board
(L1 to L2 = 16 mils)
PARAMETER VALUE UNITS
W 21 mils
S 10 mils
H 16 mils
Er (FR-4 substrate) 4.5 F/m