Datasheet

*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
CD4011BM96 SOIC D 14 2500 367.0 367.0 38.0
CD4011BMT SOIC D 14 250 367.0 367.0 38.0
CD4011BNSR SO NS 14 2000 367.0 367.0 38.0
CD4011BPWR TSSOP PW 14 2000 367.0 367.0 35.0
CD4012BM96 SOIC D 14 2500 367.0 367.0 38.0
CD4012BMT SOIC D 14 250 367.0 367.0 38.0
CD4012BNSR SO NS 14 2000 367.0 367.0 38.0
CD4012BPWR TSSOP PW 14 2000 367.0 367.0 35.0
CD4023BM96 SOIC D 14 2500 367.0 367.0 38.0
CD4023BMT SOIC D 14 250 367.0 367.0 38.0
CD4023BNSR SO NS 14 2000 367.0 367.0 38.0
CD4023BPWR TSSOP PW 14 2000 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2