Data sheet acquired from Harris Semiconductor SCHS031B – Revised July 2003 Copyright 2003, Texas Instruments Incorporated
The CD4026B- and CD4033B-series types are supplied in 16-lead dual-in-line plastic packages (E suffix), 16-lead small-outline packages (NSR suffix), and 16-lead thin shrink small-outline packages (PW and PWR suffixes).
PACKAGE OPTION ADDENDUM www.ti.
PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information.
PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant CD4026BNSR SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 CD4026BPWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.
PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CD4026BNSR SO NS 16 2000 367.0 367.0 38.0 CD4026BPWR TSSOP PW 16 2000 367.0 367.0 35.
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