Datasheet

ManualsBrandsTEXAS INSTRUMENTS ManualsInterface ICsInterface IC - multiplexers, demultiplexers SOIC 24

Data sheet acquired from Harris Semiconductor

SCHS052B – Revised June 2003

The CD4067B and CD4097B types are supplied

in 24-lead hermetic dual-in-line ceramic

packages (F3A suffix), 24-lead dual-in-line

plastic packages (E suffix), 24-lead

small-outline packages (M, M96, and NSR

suffixes), and 24-lead thin shrink small-outline

packages (P and PWR suffixes).

Summary of content (17 pages)

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Data sheet acquired from Harris Semiconductor SCHS052B – Revised June 2003 The CD4067B and CD4097B types are supplied in 24-lead hermetic dual-in-line ceramic packages (F3A suffix), 24-lead dual-in-line plastic packages (E suffix), 24-lead small-outline packages (M, M96, and NSR suffixes), and 24-lead thin shrink small-outline packages (P and PWR suffixes).
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties.
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PACKAGE MATERIALS INFORMATION www.ti.com 11-Oct-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device CD4067BM96 Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SOIC DW 24 2000 330.0 24.4 10.75 15.7 2.7 12.0 24.0 Q1 CD4067BM96G4 SOIC DW 24 2000 330.0 24.4 10.75 15.7 2.7 12.0 24.0 Q1 CD4097BPWR TSSOP PW 24 2000 330.0 16.4 6.95 8.3 1.6 8.0 16.
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PACKAGE MATERIALS INFORMATION www.ti.com 11-Oct-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CD4067BM96 SOIC DW 24 2000 367.0 367.0 45.0 CD4067BM96G4 SOIC DW 24 2000 367.0 367.0 45.0 CD4097BPWR TSSOP PW 24 2000 367.0 367.0 38.
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MECHANICAL DATA MCDI004A – JANUARY 1995 – REVISED NOVEMBER 1997 J (R-GDIP-T**) CERAMIC DUAL-IN-LINE PACKAGE 24 PINS SHOWN B 13 24 C 1 12 0.065 (1,65) 0.045 (1,14) Lens Protrusion (Lens Optional) 0.010 (0.25) MAX 0.175 (4,45) 0.140 (3,56) 0.090 (2,29) 0.060 (1,53) A Seating Plane 0.018 (0,46) MIN 24 PINS ** DIM ”A” ”B” ”C” NARR 0.125 (3,18) MIN 0.022 (0,56) 0.014 (0,36) 0.100 (2,54) 0.012 (0,30) 0.008 (0,20) 28 WIDE NARR 40 32 WIDE NARR WIDE NARR WIDE MAX 0.624(15,85) 0.
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MECHANICAL DATA MPDI006B – SEPTEMBER 2001 – REVISED APRIL 2002 N (R–PDIP–T24) PLASTIC DUAL–IN–LINE 1.222 (31,04) MAX 24 13 0.360 (9,14) MAX 1 12 0.070 (1,78) MAX 0.200 (5,08) MAX 0.425 (10,80) MAX 0.020 (0,51) MIN Seating Plane 0.125 (3,18) MIN 0.100 (2,54) 0’–15’ 0.021 (0,53) 0.015 (0,38) 0.010 (0,25) 0.010 (0,25) NOM 4040051–3/D 09/01 NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C.
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IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.