Datasheet

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Data sheet acquired from Harris Semiconductor

SCHS069D − Revised November 2004

The CD4504B types are supplied in 16-lead hermetic dual-in-line

ceramic packages (F3A suffix), 16-lead dual-in-line plastic

packages (E suffix), 16-lead small-outline packages (M, M96, and

MT suffixes), and 16-lead thin shrink small-outline packages (PW

and PWR suffixes).

Summary of content (16 pages)

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Data sheet acquired from Harris Semiconductor SCHS069D − Revised November 2004 The CD4504B types are supplied in 16-lead hermetic dual-in-line ceramic packages (F3A suffix), 16-lead dual-in-line plastic packages (E suffix), 16-lead small-outline packages (M, M96, and MT suffixes), and 16-lead thin shrink small-outline packages (PW and PWR suffixes).
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VGEN 1.5 1.5 1.5 1.5 2 2 2 2 1.
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5
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.com 30-Jan-2012 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant CD4504BM96 SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 CD4504BPWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.
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PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CD4504BM96 SOIC D 16 2500 333.2 345.9 28.6 CD4504BPWR TSSOP PW 16 2000 367.0 367.0 35.
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IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.