Datasheet

ManualsBrandsTEXAS INSTRUMENTS ManualsLogic ICsLogic IC - Demultiplexer, decoder Decoder/demultiplexer Dual supply SOIC 24

Data sheet acquired from Harris Semiconductor

SCHS074A – Revised June 2003

The CD4514B and CD4515B types are supplied

in 16-lead hermetic dual-in-line ceramic

packages (F3A suffix), 16-lead dual-in-line

plastic packages (E suffix), and 16-lead

small-outline packages (M and M96 suffixes).

Summary of content (15 pages)

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Data sheet acquired from Harris Semiconductor SCHS074A – Revised June 2003 The CD4514B and CD4515B types are supplied in 16-lead hermetic dual-in-line ceramic packages (F3A suffix), 16-lead dual-in-line plastic packages (E suffix), and 16-lead small-outline packages (M and M96 suffixes).
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.com 25-Sep-2013 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
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PACKAGE MATERIALS INFORMATION www.ti.com 26-Jan-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant CD4514BM96 SOIC DW 24 2000 330.0 24.4 10.75 15.7 2.7 12.0 24.0 Q1 CD4514BM96G4 SOIC DW 24 2000 330.0 24.4 10.75 15.7 2.7 12.0 24.0 Q1 CD4515BM96 SOIC DW 24 2000 330.0 24.4 10.75 15.7 2.7 12.0 24.
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PACKAGE MATERIALS INFORMATION www.ti.com 26-Jan-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CD4514BM96 SOIC DW 24 2000 367.0 367.0 45.0 CD4514BM96G4 SOIC DW 24 2000 367.0 367.0 45.0 CD4515BM96 SOIC DW 24 2000 367.0 367.0 45.
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MECHANICAL DATA MCDI004A – JANUARY 1995 – REVISED NOVEMBER 1997 J (R-GDIP-T**) CERAMIC DUAL-IN-LINE PACKAGE 24 PINS SHOWN B 13 24 C 1 12 0.065 (1,65) 0.045 (1,14) Lens Protrusion (Lens Optional) 0.010 (0.25) MAX 0.175 (4,45) 0.140 (3,56) 0.090 (2,29) 0.060 (1,53) A Seating Plane 0.018 (0,46) MIN 24 PINS ** DIM ”A” ”B” ”C” NARR 0.125 (3,18) MIN 0.022 (0,56) 0.014 (0,36) 0.100 (2,54) 0.012 (0,30) 0.008 (0,20) 28 WIDE NARR 40 32 WIDE NARR WIDE NARR WIDE MAX 0.624(15,85) 0.
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MECHANICAL DATA MPDI006B – SEPTEMBER 2001 – REVISED APRIL 2002 N (R–PDIP–T24) PLASTIC DUAL–IN–LINE 1.222 (31,04) MAX 24 13 0.360 (9,14) MAX 1 12 0.070 (1,78) MAX 0.200 (5,08) MAX 0.425 (10,80) MAX 0.020 (0,51) MIN Seating Plane 0.125 (3,18) MIN 0.100 (2,54) 0’–15’ 0.021 (0,53) 0.015 (0,38) 0.010 (0,25) 0.010 (0,25) NOM 4040051–3/D 09/01 NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C.
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IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.