Data sheet acquired from Harris Semiconductor SCHS291 This data sheet is applicable to the CD74AC563, CD54/74AC573, and CD54/74ACT573. The CD54AC563 and CD54/74ACT563 were not acquired from Harris Semiconductor.
PACKAGE OPTION ADDENDUM www.ti.
PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 11-Apr-2013 Status (1) CD74ACT573MG4 ACTIVE Package Type Package Pins Package Drawing Qty SOIC DW 20 25 Eco Plan Lead/Ball Finish (2) Green (RoHS & no Sb/Br) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) CU NIPDAU Level-1-260C-UNLIM (4) -55 to 125 ACT573M (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs.
PACKAGE MATERIALS INFORMATION www.ti.com 26-Jan-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant CD74AC573M96 SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1 CD74ACT573M96 SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.
PACKAGE MATERIALS INFORMATION www.ti.com 26-Jan-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CD74AC573M96 SOIC DW 20 2000 367.0 367.0 45.0 CD74ACT573M96 SOIC DW 20 2000 367.0 367.0 45.
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