Datasheet

ManualsBrandsTEXAS INSTRUMENTS ManualsLogic ICsLogic IC - Multiplexer Multiplexer Single supply PDIP 16



     

SCHS340B − MARCH 2003 - REVISED JUNE 2003

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

D Inputs Are TTL-Voltage Compatible

D Speed of Bipolar F, AS, and S, With

Significantly Reduced Power Consumption

D Balanced Propagation Delays

D ±24-mA Output Drive Current

− Fanout to 15 F Devices

D SCR-Latchup-Resistant CMOS Process and

Circuit Design

D Exceeds 2-kV ESD Protection Per

MIL-STD-883, Method 3015

description/ordering information

This quadruple 2-line to 1-line data selector/multiplexer is designed for 4.5-V to 5.5-V V

operation.

The CD74ACT157 features a common strobe (G

) input. When the strobe is high, all outputs are low. When the

strobe is low, a 4-bit word is selected from one of two sources and is routed to the four outputs. The device

provides true data.

ORDERING INFORMATION

PACKAGE

†

ORDERABLE

PART NUMBER

TOP-SIDE

MARKING

PDIP − E Tube CD74ACT157E CD74ACT157E

SOIC − M

Tube CD74ACT157M

ACT157M

−55°C to 125°C

SOIC − M

Tape and reel CD74ACT157M96

ACT157M

−55 C to 125 C

TSSOP − PW

Tube CD74ACT157PW

HM157

TSSOP − PW

Tape and reel CD74ACT157PWR

HM157

†

Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines

are available at www.ti.com/sc/package.

FUNCTION TABLE

INPUTS

OUTPUT

G A/B A B

OUTPUT

H X X X L

L LLX L

L LHX H

L HXL L

L H X H H

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Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

A/B

GND

E, M, OR PW PACKAGE

(TOP VIEW)

Summary of content (23 pages)

PAGE 1
SCHS340B − MARCH 2003 - REVISED JUNE 2003 D Inputs Are TTL-Voltage Compatible D Speed of Bipolar F, AS, and S, With E, M, OR PW PACKAGE (TOP VIEW) Significantly Reduced Power Consumption A /B 1A 1B 1Y 2A 2B 2Y GND D Balanced Propagation Delays D ±24-mA Output Drive Current D D − Fanout to 15 F Devices SCR-Latchup-Resistant CMOS Process and Circuit Design Exceeds 2-kV ESD Protection Per MIL-STD-883, Method 3015 1 16 2 15 3 14 4 13 5 12
PAGE 2
SCHS340B − MARCH 2003 - REVISED JUNE 2003 logic diagram (positive logic) 1A 2 4 3 1Y 1B 2A 5 7 2B 3A 6 11 9 3B 4A 10 G A/B 3Y 14 12 4B 2Y 13 4Y 15 1 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.
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SCHS340B − MARCH 2003 - REVISED JUNE 2003 recommended operating conditions (see Note 3) −55°C to 125°C TA = 25°C −40°C to 85°C UNIT MIN MAX MIN MAX MIN MAX 4.5 5.5 4.5 5.5 4.5 5.5 VCC VIH Supply voltage VIL VI Low-level input voltage Input voltage 0 VO IOH Output voltage 0 High-level output current −24 IOL ∆t/∆v Low-level output current 24 Input transition rise or fall rate 10 High-level input voltage 2 2 0.
PAGE 4
SCHS340B − MARCH 2003 - REVISED JUNE 2003 switching characteristics over recommended operating free-air temperature range, VCC = 5 V ± 0.5 V, CL = 50 pF (unless otherwise noted) (see Figure 1) FROM (INPUT) TO (OUTPUT) tPLH tPHL A or B Any Y tPLH tPHL A/B Any Y tPLH tPHL G Any Y PARAMETER −55°C to 125°C −40°C to 85°C MIN MAX MIN MAX 2.4 9.5 2.5 8.6 2.4 9.5 2.5 8.6 3.6 14.5 3.8 13.2 3.6 14.5 3.8 13.2 3.4 13.5 3.
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SCHS340B − MARCH 2003 - REVISED JUNE 2003 PARAMETER MEASUREMENT INFORMATION S1 R1 = 500 Ω From Output Under Test 2 × VCC Open GND CL = 50 pF (see Note A) R2 = 500 Ω TEST S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open 2 × VCC GND tw 3V 1.5 V Input LOAD CIRCUIT 1.5 V 0V VOLTAGE WAVEFORMS PULSE DURATION CLR Input 3V Reference Input 3V 1.5 V 1.5 V 0V 0V trec Data Input 3V 1.5 V CLK th tsu 1.
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PACKAGE OPTION ADDENDUM www.ti.
PAGE 7
PACKAGE OPTION ADDENDUM www.ti.com 18-Sep-2008 provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
PAGE 8
PACKAGE MATERIALS INFORMATION www.ti.com 19-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel Diameter Width (mm) W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant CD74ACT157M96 SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 CD74ACT157PWR TSSOP PW 16 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.
PAGE 9
PACKAGE MATERIALS INFORMATION www.ti.com 19-Mar-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CD74ACT157M96 SOIC D 16 2500 333.2 345.9 28.6 CD74ACT157PWR TSSOP PW 16 2000 346.0 346.0 29.
PAGE 10
MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters.
PAGE 11
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PAGE 14
PACKAGE OPTION ADDENDUM www.ti.
PAGE 15
PACKAGE OPTION ADDENDUM www.ti.com 7-May-2010 provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
PAGE 16
PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant CD74ACT157M96 SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 CD74ACT157PWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.
PAGE 17
PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CD74ACT157M96 SOIC D 16 2500 333.2 345.9 28.6 CD74ACT157PWR TSSOP PW 16 2000 367.0 367.0 35.
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IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.