Data sheet acquired from Harris Semiconductor SCHS292 This data sheet is applicable to the CD54/74AC574 and CD54/74ACT574. The CD54/74AC564 and CD54/74ACT564 were not acquired from Harris Semiconductor.
PACKAGE OPTION ADDENDUM www.ti.
PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 11-Apr-2013 Status (1) CD74ACT574MG4 ACTIVE Package Type Package Pins Package Drawing Qty SOIC DW 20 25 Eco Plan Lead/Ball Finish (2) Green (RoHS & no Sb/Br) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) CU NIPDAU Level-1-260C-UNLIM (4) -55 to 125 ACT574M (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs.
PACKAGE MATERIALS INFORMATION www.ti.com 26-Jan-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant CD74AC574M96 SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1 CD74ACT574M96 SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.
PACKAGE MATERIALS INFORMATION www.ti.com 26-Jan-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CD74AC574M96 SOIC DW 20 2000 367.0 367.0 45.0 CD74ACT574M96 SOIC DW 20 2000 367.0 367.0 45.
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