Datasheet
1
FEATURES
See mechanical drawings for dimensions.
DBV PACKAGE
(TOP VIEW)
5
1
V
CC
OE
2
A
3
4
GND Y
DCK PACKAGE
(TOP VIEW)
2
A
3
4
GND
V
CC
5
OE
Y
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DESCRIPTION/ORDERING INFORMATION
SN74LVC1G125-Q1
www.ti.com
........................................................................................................................................................... SGES002C – APRIL 2003 – REVISED APRIL 2008
SINGLE BUS BUFFER GATE
WITH 3-STATE OUTPUT
• Qualified for Automotive Applications • Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
• Supports 5-V V
CC
Operation
• ESD Protection Exceeds JESD 22
• Inputs Accept Voltages to 5.5 V
– 2000-V Human-Body Model (A114-A)
• Low Power Consumption, 10- µ A Max I
CC
– 200-V Machine Model (A115-A)
• ± 24-mA Output Drive at 3.3 V
– 1000-V Charged-Device Model (C101)
• I
off
Supports Partial-Power-Down Mode
Operation
This bus buffer gate is designed for 1.65-V to 5.5-V V
CC
operation.
The SN74LVC1G125 is a single line driver with a 3-state output. The output is disabled when the output-enable
( OE) input is high.
This device is fully specified for partial-power-down applications using I
off
. The I
off
circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
To ensure the high-impedance state during power up or power down, OE should be tied to V
CC
through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
ORDERING INFORMATION
(1)
T
A
PACKAGE
(2)
ORDERABLE PART NUMBER TOP-SIDE MARKING
(3)
SOT (SC-70) – DCK Reel of 3000 1P1G125QDCKRQ1 CM_
– 40 ° C to 125 ° C
SOT (SOT-23) – DBV Reel of 3000 CLVC1G125QDBVRQ1 C25_
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com .
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging .
(3) DBV/DCK: The actual top-side marking has one additional character that designates the wafer fab/assembly site.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2003 – 2008, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.