Datasheet

DCK PACKAGE
(TOP VIEW)
Q
3
4
D
2
GND
5
1
CLK
V
CC
6
CLR
SN74LVC1G175-EP
www.ti.com
SGLS366A AUGUST 2006REVISED DECEMBER 2010
SINGLE D-TYPE FLIP-FLOP
WITH ASYNCHRONOUS CLEAR
Check for Samples: SN74LVC1G175-EP
1
FEATURES
Supports 5-V V
CC
Operation SUPPORTS DEFENSE, AEROSPACE,
AND MEDICAL APPLICATIONS
Inputs Accept Voltages to 5.5 V
Controlled Baseline
Max t
pd
of 4.3 ns at 3.3 V
One Assembly/Test Site
Low Power Consumption, 10-mA Max I
CC
One Fabrication Site
±24-mA Output Drive at 3.3 V
Available in Military (–55°C/125°C)
I
off
Supports Partial Power-Down-Mode
Temperature Range
(1)
Operation
Extended Product Life Cycle
Latch-Up Performance Exceeds 100 mA Per
Extended Product-Change Notification
JESD 78, Class II
Product Traceability
ESD Protection Exceeds JESD 22
2000-V Human-Body Model (A114-A)
200-V Machine Model (A115-A)
1000-V Charged-Device Model (C101)
(1) Additional temperature ranges available - contact factory
DESCRIPTION/ORDERING INFORMATION
This single D-type flip-flop is designed for 1.65-V to 5.5-V V
CC
operation.
The SN74LVC1G175 has an asynchronous clear (CLR) input. When CLR is high, data from the input pin (D) is
transferred to the output pin (Q) on the clock's (CLK) rising edge. When CLR is low, Q is forced into the low
state, regardless of the clock edge or data on D.
This device is fully specified for partial-power-down applications using I
off
. The I
off
circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION
(1)
T
A
PACKAGE
(2)
ORDERABLE PART NUMBER TOP-SIDE MARKING
(3)
–55°C to 125°C SOT (SC-70) – DCK Reel of 3000 CLVC1G175MDCKREP BUD
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
Web site at www.ti.com.
(2) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(3) The actual top-side marking has one additional character that designates the assembly/test site.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2006–2010, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.

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