Datasheet

DAC5681Z
www.ti.com
SLLS865F AUGUST 2007REVISED AUGUST 2012
16-BIT, 1.0 GSPS 2x-4x INTERPOLATING
DIGITAL-TO-ANALOG CONVERTER (DAC)
Check for Samples: DAC5681Z
1
FEATURES
DESCRIPTION
The DAC5681Z is a 16-bit 1.0 GSPS digital-to-analog
16-Bit Digital-to-Analog Converter (DAC)
converter (DAC) with wideband LVDS data input,
1.0 GSPS Update Rate
integrated 2x/4x interpolation filters, on-board clock
16-Bit Wideband Input LVDS Data Bus
multiplier and internal voltage reference. The
DAC5681Z offers superior linearity, noise, crosstalk
8 Sample Input FIFO
and PLL phase noise performance.
High Performance
The DAC5681Z integrates a wideband LVDS port
73 dBc ACLR WCDMA TM1 at 180 MHz
with on-chip termination. Full-rate input data can be
2x-32x Clock Multiplying PLL/VCO
transferred to a single DAC channel, or half-rate and
2x or 4x Interpolation Filters
1/4-rate input data can be interpolated by on-board
2x or 4x FIR filters. Each interpolation FIR is
Stopband Transition 0.4–0.6 Fdata
configurable in either Low-Pass or High-Pass mode,
Filters Configurable in Either Low-Pass or
allowing selection of a higher order output spectral
High-Pass Mode
image. An on-chip delay lock loop (DLL) simplifies
Allows Selection of Higher Order Image
LVDS interfacing by providing skew control for the
LVDS input data clock.
On Chip 1.2 V Reference
Differential Scalable Output: 2 to 20 mA
The DAC5681Z is characterized for operation over
the industrial temperature range of –40°C to 85°C
Package: 64-Pin 9 × 9 mm QFN
and is available in a 64-pin QFN package. Other
members of the family include the dual-channel,
APPLICATIONS
interpolating DAC5682Z and the single-channel, non-
Cellular Base Stations
interpolating DAC5681.
Broadband Wireless Access (BWA)
WiMAX 802.16
Fixed Wireless Backhaul
Cable Modem Termination System (CMTS)
ORDERING INFORMATION
T
A
ORDER CODE PACKAGE DRAWING/TYPE
(1) (2) (3)
TRANSPORT MEDIA QUANTITY
DAC5681ZIRGCT Tape and Reel 250
–40°C to 85°C RGC / 64QFN Quad Flatpack No-Lead
DAC5681ZIRGCR Tape and Reel 2000
(1) Thermal Pad Size: 7,4 mm × 7,4 mm
(2) MSL Peak Temperature: Level-3-260C-168 HR
(3) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2007–2012, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.

Summary of content (58 pages)