Datasheet

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PIN CONFIGURATION (NOT TO SCALE)
DAC8832
Thermal Pad
(1)
INV
DGND
LDAC
SDI
NC
V
OUT
AGNDF
AGNDS
V
REF
−
S
V
REF
−
F
2
NOTE: (1) Exposed thermal pad must be connected to analog ground.
3 5 64
13 12 10 911
14
1
V
DD
RFB
SCLK
CS
8
7
DAC8832
SBAS380B – FEBRUARY 2006 – REVISED SEPTEMBER 2007
RGY PACKAGE
QFN-14
(TOP VIEW)
TERMINAL FUNCTIONS
TERMINAL
DESCRIPTION
NO. NAME
1 RFB Feedback resistor. Connect to the output of external operational amplifier in bipolar mode.
2 V
OUT
Analog output of DAC
3 AGNDF Analog ground (Force)
4 AGNDS Analog ground (Sense)
5 V
REF-
S Voltage reference input (Sense). Connect to external voltage reference
6 V
REF-
F Voltage reference input (Force). Connect to external voltage reference
7 CS Chip select input (active low). Data are not clocked into SDI unless CS is low.
8 SCLK Serial clock input.
9 NC No internal connection
10 SDI Serial data input. Data are latched into input register on the rising edge of SCLK.
Load DAC control input. Active low. When LDAC is Low, the DAC latch is simultaneously updated with the content
11 LDAC
of the input register.
12 DGND Digital ground
13 INV Junction point of internal scaling resistors. Connect to external operational amplifier inverting input in bipolar mode.
14 V
DD
Analog power supply, +3 V to +5 V.
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Product Folder Link(s): DAC8832