Datasheet

DRV11873
www.ti.com SLWS237 –NOVEMBER 2012
APPLICATION INFORMATION
DRV11873 only requires five external components. A 10-µF or higher ceramic capacitor connected to V
CC
and
ground is needed for decoupling. During layout, the strategy of ground copper pour is very important to enhance
the thermal performance. For two or more layers, eight thermal vias are needed. Refer to Figure 1 for an
example of PCB layout. For high speed motors (FS = 1), which need higher start up current, three Schottkey
diodes are needed between phases U, V, W and ground. Each diode anode terminal needs to be connected to
ground and the cathode terminal needs to be connected to either U or V or W.
Figure 1. PCB Layout
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