Datasheet

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

SLOS389A – NOVEMBER 2001– REVISED MAY 2002

±    

FEATURES

D ±3-A Maximum Output Current

D Low Supply Voltage Operation: 2.8 V to 5.5 V

D High Efficiency Generates Less Heat

D Over-Current and Thermal Protection

D Fault Indicators for Over-Current, Thermal

and Under-Voltage Conditions

D Two Selectable Switching Frequencies

D Internal or External Clock Sync

D PWM Scheme Optimized for EMI

D 9×9 mm PowerPAD Quad Flatpack

APPLICATIONS

D Thermoelectric Cooler (TEC) Driver

D Laser Diode Biasing

DESCRIPTION

The DRV591 is a high-efficiency, high-current power

amplifier ideal for driving a wide variety of

thermoelectric cooler elements in systems powered

from 2.8 V to 5.5 V. PWM operation and low output

stage on-resistance significantly decrease power

dissipation in the amplifier.

The DRV591 is internally protected against thermal and

current overloads. Logic-level fault indicators signal

when the junction temperature has reached

approximately 130°C to allow for system-level

shutdown before the amplifier’s internal thermal

shutdown circuitry activates. The fault indicators also

signal when an over-current event has occurred. If the

over-current circuitry is tripped, the DRV591

automatically resets (see application information

section for more details).

The PWM switching frequency may be set to 500 kHz

or 100 kHz depending on system requirements. To

eliminate external components, the gain is fixed at

approximately 2.3 V/V.

1 µF

AVDD

AGND (Connect to PowerPAD)

ROSC

COSC

AREF

IN+

IN–IN–

FAULT1

FAULT0

PVDD

OUT–

PGND

OUT+

PVDD

FREQ

120 kΩ

220 pF

1 µF

Shutdown Control

1 kΩ

DC Control

Voltage

10 µF

VDD

10 µH

10 µF

10 µH

10 µF

1 µF

FAULT1

FAULT0

To TEC or Laser

Diode Anode

To TEC or Laser

Diode Cathode

1 µF

SHUTDOWN

INT/EXT

PowerPAD is a trademark of Texas Instruments.

         

          

         

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments

semiconductor products and disclaimers thereto appears at the end of this data sheet.

www.ti.com

Summary of content (21 pages)

PAGE 1
www.ti.com SLOS389A – NOVEMBER 2001– REVISED MAY 2002 ± FEATURES DESCRIPTION D D D D D ±3-A Maximum Output Current The DRV591 is a high-efficiency, high-current power amplifier ideal for driving a wide variety of thermoelectric cooler elements in systems powered from 2.8 V to 5.5 V. PWM operation and low output stage on-resistance significantly decrease power dissipation in the amplifier.
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www.ti.com SLOS389A – NOVEMBER 2001– REVISED MAY 2002 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure.
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www.ti.com SLOS389A – NOVEMBER 2001– REVISED MAY 2002 ELECTRICAL CHARACTERISTICS over operating free-air temperature range unless otherwise noted PARAMETER TEST CONDITIONS |VOO| Output offset voltage (measured differentially) |IIH| High-level input current |IIL| Low-level input current Vn Integrated output noise voltage VICM Common mode voltage range Common-mode Av Closed-loop voltage gain VI = VDD/2, VDD = 5.5V, IO = 0 A VI = VDD VDD = 5.
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www.ti.com SLOS389A – NOVEMBER 2001– REVISED MAY 2002 Terminal Functions TERMINAL I/O DESCRIPTION NAME NO.
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www.ti.com SLOS389A – NOVEMBER 2001– REVISED MAY 2002 FUNCTIONAL BLOCK DIAGRAM AVDD AGND AVDD PVDD IN– R + _ 2.34 × R _ + Gate Drive OUT– _ + _ + + _ PGND PVDD IN+ R 2.
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www.ti.com SLOS389A – NOVEMBER 2001– REVISED MAY 2002 TYPICAL CHARACTERISTICS EFFICIENCY vs LOAD RESISTANCE EFFICIENCY vs LOAD RESISTANCE 100 100 90 90 PO = 2 W 80 70 PO = 0.5 W 60 50 40 50 40 30 20 20 VDD = 5 V fS = 500 kHz PO = 0.25 W 60 30 10 VDD = 3.3 V fS = 500 kHz 10 0 0 1 2 3 4 5 6 7 8 RL – Load Resistance – Ω 9 1 10 Figure 2 IO = 1 A TA = 25°C 250 Total 150 Low Side 100 High Side 50 0 2.7 3.1 3.5 3.9 4.3 4.
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www.ti.com SLOS389A – NOVEMBER 2001– REVISED MAY 2002 TYPICAL CHARACTERISTICS SUPPLY CURRENT vs SUPPLY VOLTAGE 300 10 VDD = 3.3 V IO = 1 A VFP Package 250 No Load 9 8 Total Iq – Supply Current – mA rDS(on) – Drain-Source On-State Resistance – mΩ DRAIN-SOURCE ON-STATE RESISTANCE vs FREE-AIR TEMPERATURE 200 150 Low Side 100 High Side 7 6 5 4 3 2 50 1 0 –40 –15 10 35 60 0 2.7 85 TA – Free-Air Temperature – °C 3.1 3.5 5.
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www.ti.com SLOS389A – NOVEMBER 2001– REVISED MAY 2002 TYPICAL CHARACTERISTICS CLOSED LOOP RESPONSE 4 10 Phase 0 –10 3 –30 2 –40 Phase – ° Gain – V/V –20 Gain –50 1 –60 VDD = 5 V No Load –70 0 10 100 1k 10k f – Frequency – Hz –80 100k Figure 10 CLOSED LOOP RESPONSE 10 4 0 Phase –10 3 –30 2 –40 Phase – ° Gain – V/V –20 Gain –50 1 –60 VDD = 3.
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www.ti.com SLOS389A – NOVEMBER 2001– REVISED MAY 2002 TYPICAL CHARACTERISTICS MAXIMUM OUTPUT CURRENT vs OUTPUT VOLTAGE MAXIMUM OUTPUT CURRENT vs AMBIENT TEMPERATURE 3.5 3.5 I O – Maximum Output Current – A I O – Maximum Output Current – A 3 TJ = 100°C 2.5 TJ = 85°C 2 TJ = 125°C 1.5 1 VDD = 5 V TA = 25°C VFP Package 0.5 0 0 1 2 3 VO – Output Voltage – V 4 3 2.5 2 1.5 1 0.
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www.ti.com SLOS389A – NOVEMBER 2001– REVISED MAY 2002 For proper operation, the resistor ROSC should have 1% tolerance while capacitor COSC should be a ceramic type with 10% tolerance. Both components should be grounded to AGND, which should be connected to PGND at a single point, typically where power and ground are physically connected to the printed-circuit board.
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www.ti.com SLOS389A – NOVEMBER 2001– REVISED MAY 2002 The over-temperature fault is reported when the junction temperature exceeds 130°C. The device continues operating normally until the junction temperature reaches 190°C, at which point the IC is disabled to prevent permanent damage from occurring. The system’s controller must reduce the power demanded from the DRV591 once the over-temperature flag is set, or else the device switches off when it reaches 190°C.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device DRV591VFPR Package Package Pins Type Drawing HLQFP VFP 32 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 1000 330.0 16.4 Pack Materials-Page 1 9.6 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 9.6 1.9 12.0 16.
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PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DRV591VFPR HLQFP VFP 32 1000 367.0 367.0 38.
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IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.