Datasheet

ManualsBrandsTEXAS INSTRUMENTS ManualsPMICsPMIC - motor controllers Half-bridge (4) Parallel HTSSOP 28

DRV8814

www.ti.com

SLVSAB9D –MAY 2010–REVISED AUGUST 2013

DC MOTOR DRIVER IC

Check for Samples: DRV8814

FEATURES

Interface

• 8-V to 45-V Operating Supply Voltage Range

• Dual H-Bridge Current-Control Motor Driver

• Thermally Enhanced Surface Mount Package

– Drives Two DC Motors

APPLICATIONS

– Brake Mode

• Printers

– Two-Bit Winding Current Control Allows Up

to 4 Current Levels • Scanners

– Low MOSFET On-Resistance • Office Automation Machines

• 2.5-A Maximum Drive Current at 24 V, 25°C • Gaming Machines

• Built-In 3.3-V Reference Output • Factory Automation

• Industry Standard Parallel Digital Control • Robotics

DESCRIPTION

The DRV8814 provides an integrated motor driver solution for printers, scanners, and other automated

equipment applications. The device has two H-bridge drivers, and is intended to drive DC motors. The output

driver block for each consists of N-channel power MOSFET’s configured as H-bridges to drive the motor

windings. The DRV8814 can supply up to 2.5-A peak or 1.75-A RMS output current (with proper heatsinking at

24 V and 25°C) per H-bridge.

A simple parallel digital control interface is compatible with industry-standard devices. Decay mode is

programmable to allow braking or coasting of the motor when disabled.

Internal shutdown functions are provided for over current protection, short circuit protection, under voltage

lockout and overtemperature.

TheDRV8814 is available in a 28-pin HTSSOP package with PowerPAD™ (Eco-friendly: RoHS & no Sb/Br).

ORDERING INFORMATION

(1)

ORDERABLE PART TOP-SIDE

PACKAGE

(2)

NUMBER MARKING

–40°C to 85°C PowerPAD™ (HTSSOP) - PWP Reel of 2000 DRV8814PWPR 8814

(1) For the most current packaging and ordering information, see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2PowerPAD is a trademark of Texas Instruments.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (18 pages)

PAGE 1
DRV8814 www.ti.com SLVSAB9D – MAY 2010 – REVISED AUGUST 2013 DC MOTOR DRIVER IC Check for Samples: DRV8814 FEATURES 1 • 2 • • • Dual H-Bridge Current-Control Motor Driver – Drives Two DC Motors – Brake Mode – Two-Bit Winding Current Control Allows Up to 4 Current Levels – Low MOSFET On-Resistance 2.5-A Maximum Drive Current at 24 V, 25°C Built-In 3.
PAGE 2
DRV8814 SLVSAB9D – MAY 2010 – REVISED AUGUST 2013 www.ti.com DEVICE INFORMATION Functional Block Diagram VM VM Internal Reference & Regs 3.3V CP1 Int. VCC LS Gate Drive V3P3OUT 0.01mF CP2 VM Charge Pump VCP 3.3V 0.
PAGE 3
DRV8814 www.ti.com SLVSAB9D – MAY 2010 – REVISED AUGUST 2013 Table 1. TERMINAL FUNCTIONS NAME PIN I/O (1) EXTERNAL COMPONENTS OR CONNECTIONS DESCRIPTION POWER AND GROUND GND 14, 28 - Device ground VMA 4 - Bridge A power supply VMB 11 - Bridge B power supply V3P3OUT 15 O 3.3-V regulator output CP1 1 IO Charge pump flying capacitor CP2 2 IO Charge pump flying capacitor VCP 3 IO High-side gate drive voltage Connect a 0.1-μF 16-V ceramic capacitor and a 1-MΩ to VM.
PAGE 4
DRV8814 SLVSAB9D – MAY 2010 – REVISED AUGUST 2013 www.ti.com PWP PACKAGE (TOP VIEW) CP1 CP2 VCP VMA AOUT1 ISENA AOUT2 BOUT2 ISENB BOUT1 VMB AVREF BVREF GND 1 28 2 27 3 4 26 5 24 25 6 7 8 23 GND (PPAD) 22 21 9 20 10 19 11 18 12 17 13 16 14 15 GND BI1 BI0 AI1 AI0 BPHASE BENBL AENBL APHASE DECAY nFAULT nSLEEP nRESET V3P3OUT ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) VMx VREF (1) (2) VALUE UNIT Power supply voltage range –0.
PAGE 5
DRV8814 www.ti.com SLVSAB9D – MAY 2010 – REVISED AUGUST 2013 THERMAL INFORMATION DRV8814 THERMAL METRIC (1) PWP UNITS 28 PINS Junction-to-ambient thermal resistance (2) θJA 31.6 (3) θJCtop Junction-to-case (top) thermal resistance θJB Junction-to-board thermal resistance (4) 5.6 ψJT Junction-to-top characterization parameter (5) 0.2 ψJB Junction-to-board characterization parameter (6) 5.5 θJCbot Junction-to-case (bottom) thermal resistance (7) 1.4 (1) (2) (3) (4) (5) (6) (7) 15.
PAGE 6
DRV8814 SLVSAB9D – MAY 2010 – REVISED AUGUST 2013 www.ti.com ELECTRICAL CHARACTERISTICS over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT POWER SUPPLIES IVM VM operating supply current VM = 24 V, fPWM < 50 kHz 5 8 mA IVMQ VM sleep mode supply current VM = 24 V 10 20 μA VUVLO VM undervoltage lockout voltage VM rising 7.8 8.2 V 3.3 3.4 V V3P3OUT REGULATOR V3P3 V3P3OUT voltage IOUT = 0 to 1 mA 3.
PAGE 7
DRV8814 www.ti.com SLVSAB9D – MAY 2010 – REVISED AUGUST 2013 FUNCTIONAL DESCRIPTION PWM Motor Drivers The DRV8814 contains two H-bridge motor drivers with current-control PWM circuitry. A block diagram of the motor control circuitry is shown in Figure 1. VM OCP VM VCP, VGD AOUT1 Predrive AENBL DCM APHASE AOUT2 DECAY PWM OCP AISEN + AI[1:0] A=5 DAC 2 AVREF VM OCP VM VCP, VGD BOUT1 Predrive BENBL DCM BPHASE BOUT2 PWM OCP BISEN + BI[1:0] A =5 DAC 2 BVREF Figure 1.
PAGE 8
DRV8814 SLVSAB9D – MAY 2010 – REVISED AUGUST 2013 www.ti.com Bridge Control The xPHASE input pins control the direction of current flow through each H-bridge, and hence the direction of rotation of a DC motor. The xENBL input pins enable the H-bridge outputs when active high, and can also be used for PWM speed control of the motor. Note that the state of the DECAY pin selects the behavior of the bridge when xENBL = 0, allowing the selection of slow decay (brake) or fast decay (coast).
PAGE 9
DRV8814 www.ti.com SLVSAB9D – MAY 2010 – REVISED AUGUST 2013 Decay Mode and Braking During PWM current chopping, the H-bridge is enabled to drive current through the motor winding until the PWM current chopping threshold is reached. This is shown in Figure 2 as case 1. The current flow direction shown indicates the state when the xENBL pin is high. Once the chopping current threshold is reached, the H-bridge can operate in two different states, fast decay or slow decay.
PAGE 10
DRV8814 SLVSAB9D – MAY 2010 – REVISED AUGUST 2013 www.ti.com Blanking Time After the current is enabled in an H-bridge, the voltage on the xISEN pin is ignored for a fixed period of time before enabling the current sense circuitry. This blanking time is fixed at 3.75 μs. Note that the blanking time also sets the minimum on time of the PWM. nRESET and nSLEEP Operation The nRESET pin, when driven active low, resets the internal logic. It also disables the H-bridge drivers.
PAGE 11
DRV8814 www.ti.com SLVSAB9D – MAY 2010 – REVISED AUGUST 2013 THERMAL INFORMATION Thermal Protection The DRV8814 has thermal shutdown (TSD) as described above. If the die temperature exceeds approximately 150°C, the device will be disabled until the temperature drops to a safe level. Any tendency of the device to enter TSD is an indication of either excessive power dissipation, insufficient heatsinking, or too high an ambient temperature.
PAGE 12
PACKAGE OPTION ADDENDUM www.ti.
PAGE 13
PACKAGE MATERIALS INFORMATION www.ti.com 12-Aug-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device DRV8814PWPR Package Package Pins Type Drawing SPQ HTSSOP 2000 PWP 28 Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 330.0 16.4 Pack Materials-Page 1 6.9 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 10.2 1.8 12.0 16.
PAGE 14
PACKAGE MATERIALS INFORMATION www.ti.com 12-Aug-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DRV8814PWPR HTSSOP PWP 28 2000 367.0 367.0 38.
PAGE 15
PAGE 16
PAGE 17
PAGE 18
IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.