Datasheet

ManualsBrandsTEXAS INSTRUMENTS ManualsPMICsPMIC - motor controllers Half-bridge (4) Step/polarity HTSSOP 28

DRV8818

www.ti.com

SLVSAX9C –SEPTEMBER 2011–REVISED NOVEMBER 2013

STEPPER MOTOR CONTROLLER IC

Check for Samples: DRV8818

FEATURES

• Pulse Width Modulation (PWM) Microstepping

APPLICATIONS

Motor Driver

• Printers

– Built-In Microstepping Indexer

• Textile Machinery

– Up to 2.5-A Current Per Winding

• Positioning/Tracking

– Microstepping Indexer Provides up to 1/8-

• Factory Automation

Step Operation

• Robotics

– Low 0.37-Ω (HS + LS) MOSFET On-

Resistance (at 25°)

– Programmable Mixed Decay, Blanking, and

Off Time

• Pin-Compatible Upgrade to DRV8811 With

Lower R

ds(on)

• 8-V to 35-V Operating Supply Voltage Range

• Thermally Enhanced Surface Mount Package

DESCRIPTION/ORDERING INFORMATION

The DRV8818 provides an integrated stepper motor driver solution for printers, scanners, and other automated

equipment applications. The device has two H-bridge drivers, as well as microstepping indexer logic to control a

stepper motor.

The output driver block for each consists of N-channel power MOSFETs configured as full H-bridges to drive the

motor windings.

A simple step/direction interface allows easy interfacing to controller circuits. Pins allow configuration of the

motor in full-step, half-step, quarter-step, or eighth-step modes. Decay mode and PWM off time are

programmable.

Internal shutdown functions are provided for over current protection, short circuit protection, under-voltage

lockout and overtemperature.

The DRV8818 is packaged in a PowerPAD ™ 28-pin HTSSOP package with PowerPAD™ (Eco-friendly: RoHS

and no Sb/Br).

ORDERING INFORMATION

(1)

PACKAGE

(2)

ORDERABLE PART NUMBER TOP-SIDE MARKING

Reel of 2000 DRV8818PWPR

PowerPAD™ (HTSSOP) – PWP DRV8818

Tube of 50 DRV8818PWP

(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2PowerPAD is a trademark of Texas Instruments.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (21 pages)

PAGE 1
DRV8818 www.ti.com SLVSAX9C – SEPTEMBER 2011 – REVISED NOVEMBER 2013 STEPPER MOTOR CONTROLLER IC Check for Samples: DRV8818 FEATURES 1 • 2 • • • Pulse Width Modulation (PWM) Microstepping Motor Driver – Built-In Microstepping Indexer – Up to 2.5-A Current Per Winding – Microstepping Indexer Provides up to 1/8Step Operation – Low 0.
PAGE 2
DRV8818 SLVSAX9C – SEPTEMBER 2011 – REVISED NOVEMBER 2013 www.ti.com FUNCTIONAL BLOCK DIAGRAM VM VCC VM VCC CP1 Int. VCC 0.22 µF Internal Reference & Reg VGD Int. Ref Charge Pump CP2 VM VCC LS Gate Drive VCP Thermal Shut down 0.
PAGE 3
DRV8818 www.ti.com SLVSAX9C – SEPTEMBER 2011 – REVISED NOVEMBER 2013 TERMINAL FUNCTIONS NO. I/O (1) GND 7, 21 - Device ground VMA 28 - Bridge A power supply VMB 15 - Bridge B power supply VCC 10 - Logic supply voltage Connect to 3-V to 5-V logic supply. Bypass to GND with a 0.1-μF ceramic capacitor. CP1 23 IO Charge pump flying capacitor Connect a 0.22-μF capacitor between CP1 and CP2. CP2 24 IO Charge pump flying capacitor Connect a 0.22-μF capacitor between CP1 and CP2.
PAGE 4
DRV8818 SLVSAX9C – SEPTEMBER 2011 – REVISED NOVEMBER 2013 www.ti.com PWP (HTSSOP) PACKAGE ISENA HOME DIR AOUT1 DECAY RCA GND VREF RCB VCC BOUT1 USM1 USM0 ISENB ABSOLUTE MAXIMUM RATINGS (1) 1 2 3 4 5 6 7 8 9 10 11 12 13 14 GND (PPAD) 28 27 26 25 24 23 22 21 20 19 18 17 16 15 VMA SLEEPn ENABLEn AOUT2 CP2 CP1 VCP GND VGD STEP BOUT2 RESETn SRn VMB (2) (3) MIN MAX VMX Power supply voltage range –0.3 35 V VCC Power supply voltage range –0.
PAGE 5
DRV8818 www.ti.com SLVSAX9C – SEPTEMBER 2011 – REVISED NOVEMBER 2013 RECOMMENDED OPERATING CONDITIONS TA = 25°C (unless otherwise noted) MIN (1) NOM MAX UNIT VM Motor power supply voltage range 8 35 V VCC Logic power supply voltage range 3 5.5 V VREF VREF input voltage 0 VCC V RX RX resistance value 12 56 100 kΩ CX CX capacitance value 470 680 1500 pF (1) All VM pins must be connected to the same supply voltage.
PAGE 6
DRV8818 SLVSAX9C – SEPTEMBER 2011 – REVISED NOVEMBER 2013 www.ti.com ELECTRICAL CHARACTERISTICS (continued) TA = 25°C (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT 150 160 180 °C Protection Circuits TTSD Thermal shutdown temperature IOCP Overcurrent protection level Die temperature tOCP OCP deglitch time 1.5 µs tRET OCP retry time 800 µs 3.
PAGE 7
DRV8818 www.ti.com SLVSAX9C – SEPTEMBER 2011 – REVISED NOVEMBER 2013 FUNCTIONAL DESCRIPTION PWM H-Bridge Drivers DRV8818 contains two H-bridge motor drivers with current-control PWM circuitry, and a microstepping indexer. A block diagram of the motor control circuitry is shown below. VM VGD VMA VCP AOUT1 RCA + Predrive Step Motor AOUT2 - PWM + ISENA + - A=8 DAC VM VGD Control / Indexer Logic VMB VCP BOUT1 Predrive BOUT2 PWM ISENB + A=8 DAC RCB DECAY VREF Figure 1.
PAGE 8
DRV8818 SLVSAX9C – SEPTEMBER 2011 – REVISED NOVEMBER 2013 www.ti.com Current Regulation The PWM chopping current is set by a comparator, which compares the voltage across a current sense resistor, multiplied by a factor of 8, with a reference voltage. The reference voltage is input from the VREF pin. The fullscale (100%) chopping current is calculated as follows: ICHOP = VREFX 8 · RISENSE (1) Example: If a 0.22-Ω sense resistor is used and the VREFx pin is 3.
PAGE 9
DRV8818 www.ti.com SLVSAX9C – SEPTEMBER 2011 – REVISED NOVEMBER 2013 VM 1 Drive current 1 xOUT2 xOUT1 3 2 Fast decay (reverse) 3 Slow decay (brake) 2 Figure 2. Decay Mode The DRV8818 also supports a mixed decay mode. Mixed decay mode begins as fast decay, but after a period of time switches to slow decay mode for the remainder of the fixed off time.
PAGE 10
DRV8818 SLVSAX9C – SEPTEMBER 2011 – REVISED NOVEMBER 2013 www.ti.com PWM ON PWM OFF ON ITRIP ON 0.6 × VCC (tOFF) Q S Q R PWM_ON ITRIP VBLANK BLANK RCx Winding Current PWM R 0.6 × VBLANK RCx VCC C PWM_OFF VCC 0.21 × VCC VDECAY Voltage 0.21 × VCC FAST BLANK (tFD) SLOW FAST_DECAY DECAY DECAY To other PWM Figure 3. PWM Microstepping Indexer Built-in indexer logic in the DRV8818 allows a number of different stepping configurations.
PAGE 11
DRV8818 www.ti.com FULL STEP USM = 00 SLVSAX9C – SEPTEMBER 2011 – REVISED NOVEMBER 2013 1/4 STEP USM = 10 1/8 STEP USM = 11 1 1 1 100 0 0 2 98 20 11.325 3 92 38 22.5 4 83 56 33.75 5 71 71 45 (home state) 6 56 83 56.25 7 38 92 67.5 8 20 98 78.75 2 1 2 3 4 3 5 6 2 4 7 8 5 9 10 3 6 11 12 7 13 14 4 AOUTx BOUTx CURRENT CURRENT (% FULL-SCALE) (% FULL-SCALE) 1/2 STEP USM = 01 8 15 16 STEP ANGLE (DEGREES) 9 0 100 90 10 –20 98 101.
PAGE 12
DRV8818 SLVSAX9C – SEPTEMBER 2011 – REVISED NOVEMBER 2013 www.ti.com Protection Circuits Overcurrent Protection (OCP) If the current through any FET exceeds the preset overcurrent threshold, all FETs in the H-bridge will be disabled for a period of approximately 800 µs, or until the ENABLEn pin has been brought inactive high and then back low, or power is removed and re-applied. Overcurrent conditions are sensed in both directions; i.e.
PAGE 13
DRV8818 www.ti.com SLVSAX9C – SEPTEMBER 2011 – REVISED NOVEMBER 2013 THERMAL INFORMATION Thermal Protection The DRV8818 has thermal shutdown (TSD) as described above. If the die temperature exceeds approximately 150°C, the device will be disabled until the temperature drops to a safe level. Any tendency of the device to enter thermal shutdown is an indication of either excessive power dissipation, insufficient heatsinking, or too high an ambient temperature.
PAGE 14
DRV8818 SLVSAX9C – SEPTEMBER 2011 – REVISED NOVEMBER 2013 www.ti.com REVISION HISTORY Changes from Revision B (October 2012) to Revision C Page • Changed FEATURES section ............................................................................................................................................... 1 • Changed TERMINAL FUNCTIONS ......................................................................................................................................
PAGE 15
PACKAGE OPTION ADDENDUM www.ti.
PAGE 16
PACKAGE MATERIALS INFORMATION www.ti.com 23-Aug-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device DRV8818PWPR Package Package Pins Type Drawing SPQ HTSSOP 2000 PWP 28 Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 330.0 16.4 Pack Materials-Page 1 6.9 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 10.2 1.8 12.0 16.
PAGE 17
PACKAGE MATERIALS INFORMATION www.ti.com 23-Aug-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DRV8818PWPR HTSSOP PWP 28 2000 367.0 367.0 38.
PAGE 18
PAGE 19
PAGE 20
PAGE 21
IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.