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DRV8821

www.ti.com

SLVS912H –JANUARY 2009–REVISED AUGUST 2013

DUAL STEPPER MOTOR CONTROLLER/DRIVER

Check for Samples: DRV8821

FEATURES

• Simple Step/Direction Interface

• Fully Protected Against Undervoltage,

• Dual PWM microstepping motor driver

Overtemperature, and Overcurrent

– Built-In Microstepping Indexers

• Thermally Enhanced Surface Mount Package

– Up to 1.5-A Current Per Winding

– Three-Bit Winding Current Control Allows

APPLICATIONS

up to Eight Current Levels

• Printers

– Low MOSFET On-Resistance

• Scanners

– Selectable Slow or Mixed Decay Modes

• Office Automation Machines

• 8-V to 32-V Operating Supply Voltage Range

• Gaming Machines

• Internal Charge Pump for Gate Drive

• Factory Automation

• Built-in 3.3-V Reference

• Robotics

DESCRIPTION/ORDERING INFORMATION

The DRV8821 provides a dual microstepping-capable stepper motor controller/driver solution for printers,

scanners, and other office automation equipment applications.

Two independent stepper motor driver circuits include four H-bridge drivers and microstepping-capable indexer

logic. Each of the motor driver blocks employ N-channel power MOSFETs configured as an H-bridge to drive the

motor windings.

A simple step/direction interface allows easy interfacing to controller circuits. Pins allow configuration of the

motor in full-step, half-step, quarter-step, or eighth step modes, and the selection of slow or mixed decay modes.

Internal shutdown functions are provided for over current protection, short circuit protection, under voltage

lockout and overtemperature.

The DRV8821 is packaged in a 48-pin HTSSOP package (Eco-friendly : RoHS & no Sb/Br).

ORDERING INFORMATION

(1)

PACKAGE

(2)

ORDERABLE PART NUMBER TOP-SIDE MARKING

Reel of 2000 DRV8821DCAR

–40°C to 85°C PowerPad™ (HTSSOP) - DCA DRV8821

Tube of 40 DRV8821DCA

(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2PowerPad, PowerPAD are trademarks of Texas Instruments.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (21 pages)

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DRV8821 www.ti.com SLVS912H – JANUARY 2009 – REVISED AUGUST 2013 DUAL STEPPER MOTOR CONTROLLER/DRIVER Check for Samples: DRV8821 FEATURES 1 • Dual PWM microstepping motor driver – Built-In Microstepping Indexers – Up to 1.5-A Current Per Winding – Three-Bit Winding Current Control Allows up to Eight Current Levels – Low MOSFET On-Resistance – Selectable Slow or Mixed Decay Modes 8-V to 32-V Operating Supply Voltage Range Internal Charge Pump for Gate Drive Built-in 3.
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DRV8821 SLVS912H – JANUARY 2009 – REVISED AUGUST 2013 www.ti.com FUNCTIONAL BLOCK DIAGRAM CP1 Dig. VCC Charge Pump and Gat e Drive Regulator 3.3V Regulator V3P3 0.47µF 6.3V CP2 0.01µF 35V +24 VCP VGD 0.1µF 16V VCP · ABVREF VM · +24 0.1µF, 35V AOUT1 PWM H-b ridge driver A Step Motor AOUT2 ABSTEP AISEN ABDIR +24 ABENBLn VM ABUSM0 · 0.
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DRV8821 www.ti.com SLVS912H – JANUARY 2009 – REVISED AUGUST 2013 TERMINAL FUNCTIONS I/O (1) DESCRIPTION 1,2, 23, 24 - Motor supply voltage (multiple pins) Connect all VM pins together to motor supply voltage. Bypass each VM to GND with a 0.1-µF, 35-V ceramic capacitor. V3P3 16 - 3.3 V regulator output Bypass to GND with 0.47-μF, 6.3-V ceramic capacitor. GND 10-15, 34-39 - Power ground (multiple pins) Connect all PGND pins to GND and solder to copper heatsink areas.
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DRV8821 SLVS912H – JANUARY 2009 – REVISED AUGUST 2013 www.ti.com ESD To Logic Hysteresis Internal Pulldown Figure 1.
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DRV8821 www.ti.com SLVS912H – JANUARY 2009 – REVISED AUGUST 2013 DISSIPATION RATINGS BOARD Low-K (1) Low-K (2) High-K DCA (3) High-K (4) (1) (2) (3) (4) RθJA DERATING FACTOR ABOVE TA = 25°C TA < 25°C TA = 70°C TA = 85°C 75.7°C/W 13.2 mW/°C 1.65 W 1.06 W 0.86 W 32°C/W 31.3 mW/°C 3.91 W 2.50 W 2.03 W 30.3°C/W 33 mW/°C 4.13 W 2.48 W 2.15 W 22.3°C/W 44.8 mW/°C 5.61 W 3.59 W 2.91 W PACKAGE The JEDEC Low-K board used to derive this data was a 76-mm x 114-mm, 2-layer, 1.
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DRV8821 SLVS912H – JANUARY 2009 – REVISED AUGUST 2013 www.ti.com ELECTRICAL CHARACTERISTICS (continued) over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX 3 4.5 IOCP Overcurrent protect level 1.5 tOCP Overcurrent protect trip time 2.5 tMD Mixed decay percentage Measured from beginning of PWM cycle UNIT A μs 75 % VREF INPUT/CURRENT CONTROL ACCURACY IREF ΔICHOP 6 xVREF input current Chopping current accuracy xVREF = 3.
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DRV8821 www.ti.com SLVS912H – JANUARY 2009 – REVISED AUGUST 2013 TIMING REQUIREMENTS over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT 1 fSTEP Step frequency 2 tWH(STEP) Pulse duration, xSTEP high 2.5 200 kHz μs 3 tWL(STEP) Pulse duration, xSTEP low 2.
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DRV8821 SLVS912H – JANUARY 2009 – REVISED AUGUST 2013 www.ti.com FUNCTIONAL DESCRIPTION PWM Motor Drivers The DRV8821 contains four H-bridge motor drivers with current-control PWM circuitry. A block diagram showing drivers A and B of the motor control circuitry (as typically used to drive a bipolar stepper motor) is shown below. Drivers C and D are the same as A and B (though the Rds(on) of the output FETs is different).
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DRV8821 www.ti.com SLVS912H – JANUARY 2009 – REVISED AUGUST 2013 Current Regulation The PWM chopping current is set by a comparator which compares the voltage across a current sense resistor connected to the xISEN pins, multiplied by a factor of 5, with a reference voltage. The reference voltage is input from the xVREF pin. The full-scale (100%) chopping current is calculated as follows: 5 (1) Example: If a 0.5-Ω sense resistor is used and the VREFx pin is 2.
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DRV8821 SLVS912H – JANUARY 2009 – REVISED AUGUST 2013 www.ti.com The DRV8821 also supports a mixed decay mode. Mixed decay mode begins as fast decay, but after a period of time (75% of the PWM cycle) switches to slow decay mode for the remainder of the fixed PWM period. Mixed decay mode is only active if the current through the winding is decreasing (per the indexer step table); if the current is increasing, then slow decay is always used.
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DRV8821 www.ti.com FULL STEP xUSM = 00 SLVS912H – JANUARY 2009 – REVISED AUGUST 2013 1/4 STEP xUSM = 10 1/8 STEP xUSM = 11 1 1 1 100 0 0 2 98 20 11.25 3 92 38 22.5 4 83 56 33.75 5 71 71 45 (home state) 6 56 83 56.25 7 38 92 67.5 8 20 98 78.75 2 1 2 3 4 3 5 6 2 4 7 8 5 9 10 3 6 11 12 7 13 14 4 AOUTx BOUTx CURRENT CURRENT (% FULL-SCALE) (% FULL-SCALE) ½ STEP xUSM = 01 8 15 16 STEP ANGLE (DEGREES) 9 0 100 90 10 –20 98 101.25 11 –38 92 112.
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DRV8821 SLVS912H – JANUARY 2009 – REVISED AUGUST 2013 www.ti.com Protection Circuits The DRV8821 is fully protected against undervoltage, overcurrent and overtemperature events. Overcurrent Protection (OCP) All of the drivers in DRV8821 are protected with an OCP (Over-Current Protection) circuit. The OCP circuit includes an analog current limit circuit, which acts by removing the gate drive form each output FET if the current through it exceeds a preset level.
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DRV8821 www.ti.com SLVS912H – JANUARY 2009 – REVISED AUGUST 2013 THERMAL INFORMATION Thermal Protection The DRV8821 has thermal shutdown (TSD) as described above. If the die temperature exceeds approximately 150°C, the device will be disabled until the temperature drops to a safe level. Any tendency of the device to enter thermal shutdown is an indication of either excessive power dissipation, insufficient heatsinking, or too high an ambient temperature.
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DRV8821 SLVS912H – JANUARY 2009 – REVISED AUGUST 2013 www.ti.com 70 65 Thermal Resistance (RqJA) - °C/W 60 55 50 45 Low-K PCB (2 layer) 40 35 30 High-K PCB (4 layer with ground plane) 25 20 0 10 20 30 40 50 60 70 80 90 2 Backside Copper Area - cm Figure 4. Thermal Resistance vs.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE MATERIALS INFORMATION www.ti.com 20-Aug-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device DRV8821DCAR Package Package Pins Type Drawing SPQ HTSSOP 2000 DCA 48 Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 330.0 24.4 Pack Materials-Page 1 8.6 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 15.8 1.8 12.0 24.
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PACKAGE MATERIALS INFORMATION www.ti.com 20-Aug-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DRV8821DCAR HTSSOP DCA 48 2000 367.0 367.0 45.
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