Datasheet

ManualsBrandsTEXAS INSTRUMENTS ManualsPMICsPMIC - gate/half-bridge gate drivers Inductive NMOS HTSSOP 16

DRV8833

www.ti.com

SLVSAR1C –JANUARY 2011–REVISED JANUARY 2013

DUAL H-BRIDGE MOTOR DRIVER

Check for Samples: DRV8833

FEATURES

• Dual-H-Bridge Current-Control Motor Driver

• Wide Power Supply Voltage Range:

2.7 V – 10.8 V

– Capable of Driving Two DC Motors or One

Stepper Motor • PWM Winding Current Regulation/Limiting

– Low MOSFET On-Resistance: • Thermally Enhanced Surface Mount Packages

HS + LS 360 mΩ (PWP and RTY)

• Output Current (at V

= 5 V, 25°C)

APPLICATIONS

– 1.5-A RMS, 2-A Peak per H-Bridge in PWP

• Battery-Powered Toys

and RTY Package Options

• POS Printers

– 500-mA RMS, 2-A Peak per H-Bridge in PW

Package Option

• Video Security Cameras

• Outputs Can Be Paralleled for

• Office Automation Machines

– 3-A RMS, 4-A Peak (PWP and RTY)

• Gaming Machines

– 1-A RMS, 4-A Peak (PW)

• Robotics

DESCRIPTION

The DRV8833 provides a dual bridge motor driver solution for toys, printers, and other mechatronic applications.

The device has two H-bridge drivers, and can drive two DC brush motors, a bipolar stepper motor, solenoids, or

other inductive loads.

The output driver block of each H-bridge consists of N-channel power MOSFET’s configured as an H-bridge to

drive the motor windings. Each H-bridge includes circuitry to regulate or limit the winding current.

Internal shutdown functions with a fault output pin are provided for over current protection, short circuit

protection, under voltage lockout and overtemperature. A low-power sleep mode is also provided.

The DRV8833 is packaged in a 16-pin HTSSOP or QFN package with PowerPAD™ (Eco-friendly: RoHS & no

Sb/Br) as well as a 16-pin TSSOP package.

ORDERING INFORMATION

(1)

ORDERABLE PART TOP-SIDE

PACKAGE

(2)

NUMBER MARKING

Reel of 2000 DRV8833PWPR

PowerPAD™ (HTSSOP) - PWP DRV8833

Tube of 90 DRV8833PWP

Reel of 2000 DRV8833PWR

(TSSOP) - PW 8833PW

Tube of 90 DRV8833PW

Reel of 3000 DRV8833RTYR

PowerPAD™ (QFN) - RTY DRV8833

Reel of 250 DRV8833RTYT

(1) For the most current packaging and ordering information, see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2PowerPAD is a trademark of Texas Instruments.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (25 pages)

PAGE 1
DRV8833 www.ti.com SLVSAR1C – JANUARY 2011 – REVISED JANUARY 2013 DUAL H-BRIDGE MOTOR DRIVER Check for Samples: DRV8833 FEATURES 1 • 2 • • Dual-H-Bridge Current-Control Motor Driver – Capable of Driving Two DC Motors or One Stepper Motor – Low MOSFET On-Resistance: HS + LS 360 mΩ Output Current (at VM = 5 V, 25°C) – 1.
PAGE 2
DRV8833 SLVSAR1C – JANUARY 2011 – REVISED JANUARY 2013 www.ti.com DEVICE INFORMATION Functional Block Diagram 2.2uF VINT VM VM VM 10uF Internal Ref & Regs Charge Pump VCP 0.
PAGE 3
DRV8833 www.ti.com SLVSAR1C – JANUARY 2011 – REVISED JANUARY 2013 Table 1. TERMINAL FUNCTIONS PIN (RTY) I/O (1) 13 PPAD (PWP only) 11 PPAD - Device ground Both the GND pin and device PowerPAD must be connected to ground VM 12 10 - Device power supply Connect to motor supply. A 10-µF (minimum) ceramic bypass capacitor to GND is recommended. VINT 14 12 - Internal supply bypass Bypass to GND with 2.2-μF, 6.3-V capacitor VCP 11 9 IO High-side gate drive voltage Connect a 0.
PAGE 4
DRV8833 SLVSAR1C – JANUARY 2011 – REVISED JANUARY 2013 www.ti.
PAGE 5
DRV8833 www.ti.com SLVSAR1C – JANUARY 2011 – REVISED JANUARY 2013 ABSOLUTE MAXIMUM RATINGS (1) (2) VM Power supply voltage range VALUE UNIT –0.3 to 11.8 V –0.5 to 7 V –0.3 to 0.
PAGE 6
DRV8833 SLVSAR1C – JANUARY 2011 – REVISED JANUARY 2013 www.ti.com ELECTRICAL CHARACTERISTICS TA = 25°C (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT POWER SUPPLY IVM VM operating supply current VM = 5 V, xIN1 = 0 V, xIN2 = 0 V 1.7 3 mA IVMQ VM sleep mode supply current VM = 5 V 1.6 2.5 μA VUVLO VM undervoltage lockout voltage VM falling 2.
PAGE 7
DRV8833 www.ti.com SLVSAR1C – JANUARY 2011 – REVISED JANUARY 2013 ELECTRICAL CHARACTERISTICS (continued) TA = 25°C (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT 200 240 mV CURRENT CONTROL VTRIP xISEN trip voltage tBLANK Current sense blanking time 160 3.
PAGE 8
DRV8833 SLVSAR1C – JANUARY 2011 – REVISED JANUARY 2013 www.ti.com FUNCTIONAL DESCRIPTION PWM Motor Drivers DRV8833 contains two identical H-bridge motor drivers with current-control PWM circuitry. A block diagram of the circuitry is shown below: VM OCP VM VCP, VINT xOUT1 xIN1 Predrive DCM xOUT 2 xIN2 PWM OCP xISEN + Optional REF (200mV) Figure 1.
PAGE 9
DRV8833 www.ti.com SLVSAR1C – JANUARY 2011 – REVISED JANUARY 2013 Figure 2 shows the current paths in different drive and decay modes. VM VM 1 Forward drive 1 xOUT2 xOUT1 1 Reverse drive 1 2 Fast decay 3 Slow decay 2 Fast decay xOUT1 xOUT2 2 2 3 3 FORWARD 3 Slow decay REVERSE Figure 2. Decay Modes Current Control The current through the motor windings may be limited, or controlled, by a fixed-frequency PWM current regulation, or current chopping.
PAGE 10
DRV8833 SLVSAR1C – JANUARY 2011 – REVISED JANUARY 2013 www.ti.com nSLEEP Operation Driving nSLEEP low will put the device into a low power sleep state. In this state, the H-bridges are disabled, the gate drive charge pump is stopped, all internal logic is reset, and all internal clocks are stopped. All inputs are ignored until nSLEEP returns inactive high. When returning from sleep mode, some time (up to 1 ms) needs to pass before the motor driver becomes fully operational.
PAGE 11
DRV8833 www.ti.com SLVSAR1C – JANUARY 2011 – REVISED JANUARY 2013 APPLICATIONS INFORMATION Parallel Mode The two H-bridges in the DRV8833 can be connected in parallel for double the current of a single H-bridge. The internal dead time in the DRV8833 prevents any risk of cross-conduction (shoot-through) between the two bridges due to timing differences between the two bridges. The drawing below shows the connections. Figure 3.
PAGE 12
DRV8833 SLVSAR1C – JANUARY 2011 – REVISED JANUARY 2013 www.ti.com THERMAL INFORMATION Maximum Output Current In actual operation, the maximum output current achievable with a motor driver is a function of die temperature. This in turn is greatly affected by ambient temperature and PCB design.
PAGE 13
PACKAGE OPTION ADDENDUM www.ti.
PAGE 14
PACKAGE OPTION ADDENDUM www.ti.com 21-Mar-2013 continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
PAGE 15
PACKAGE MATERIALS INFORMATION www.ti.com 4-Mar-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ DRV8833PWPR HTSSOP Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) PWP 16 2000 330.0 12.4 6.9 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 5.6 1.6 8.0 12.0 Q1 DRV8833PWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 DRV8833RTYR QFN RTY 16 3000 330.0 12.4 4.25 4.25 1.15 8.0 12.
PAGE 16
PACKAGE MATERIALS INFORMATION www.ti.com 4-Mar-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DRV8833PWPR HTSSOP PWP 16 2000 367.0 367.0 35.0 DRV8833PWR TSSOP PW 16 2000 367.0 367.0 35.0 DRV8833RTYR QFN RTY 16 3000 367.0 367.0 35.0 DRV8833RTYT QFN RTY 16 250 210.0 185.0 35.
PAGE 17
PAGE 18
PAGE 19
PAGE 20
PAGE 21
PAGE 22
PAGE 23
PAGE 24
PAGE 25
IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.