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NRND

DS90C401

www.ti.com

SNLS002C –JUNE 1998–REVISED APRIL 2013

DS90C401 Dual Low Voltage Differential Signaling (LVDS) Driver

Check for Samples: DS90C401

FEATURES

DESCRIPTION

The DS90C401 is a dual driver device optimized for

• Ultra Low Power Dissipation

high data rate and low power applications. This

• Operates Above 155.5 Mbps

device along with the DS90C402 provides a pair chip

• Standard TIA/EIA-644

solution for a dual high speed point-to-point interface.

The DS90C401 is a current mode driver allowing

• 8 Lead SOIC Package Saves Space

power dissipation to remain low even at high

• Low Differential Output Swing typical 340 mV

frequency. In addition, the short circuit fault current is

also minimized. The device is in a 8 lead small

outline package. The differential driver outputs

provides low EMI with its low output swings typically

340 mV.

Connection Diagram

See Package Number D (SOIC)

Functional Diagram

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2All trademarks are the property of their respective owners.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (17 pages)

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NRND DS90C401 www.ti.com SNLS002C – JUNE 1998 – REVISED APRIL 2013 DS90C401 Dual Low Voltage Differential Signaling (LVDS) Driver Check for Samples: DS90C401 FEATURES DESCRIPTION • • • • • The DS90C401 is a dual driver device optimized for high data rate and low power applications. This device along with the DS90C402 provides a pair chip solution for a dual high speed point-to-point interface. The DS90C401 is a current mode driver allowing power dissipation to remain low even at high frequency.
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NRND DS90C401 SNLS002C – JUNE 1998 – REVISED APRIL 2013 www.ti.com Absolute Maximum Ratings (1) (2) −0.3V to +6V Supply Voltage (VCC) Input Voltage (DIN) −0.3V to (VCC + 0.3V) Output Voltage (DOUT+, DOUT−) −0.3V to (VCC + 0.3V) Short Circuit Duration (DOUT+, DOUT−) Continuous Maximum Package Power Dissipation @ +25°C D Package 1068 mW Derate D Package 8.5 mW/°C above +25°C −65°C to +150°C Storage Temperature Range Lead Temperature Range Soldering (4 sec.
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NRND DS90C401 www.ti.com SNLS002C – JUNE 1998 – REVISED APRIL 2013 Switching Characteristics VCC = +5.0V ±10%, TA = −40°C to +85°C (1) (2) (3) (4) (5) Symbol Parameter Conditions RL = 100Ω, CL = 5 pF (Figure 2 and Figure 3) Min Typ Max Units 0.5 2.0 3.5 ns 0.5 2.1 3.5 ns tPHLD Differential Propagation Delay High to Low tPLHD Differential Propagation Delay Low to High tSKD Differential Skew |tPHLD – tPLHD| 0 80 900 ps tSK1 Channel-to-Channel Skew (2) 0 0.3 1.
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NRND DS90C401 SNLS002C – JUNE 1998 – REVISED APRIL 2013 www.ti.com Figure 3.
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NRND DS90C401 www.ti.com SNLS002C – JUNE 1998 – REVISED APRIL 2013 TYPICAL APPLICATION Figure 4. Point-to-Point Application Applications Information LVDS drivers and receivers are intended to be primarily used in an uncomplicated point-to-point configuration as is shown in Figure 4. This configuration provides a clean signaling environment for the quick edge rates of the drivers.
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NRND DS90C401 SNLS002C – JUNE 1998 – REVISED APRIL 2013 www.ti.com PIN DESCRIPTIONS Pin No. Name Description 4, 8 DIN 3, 7 DOUT+ TTL/CMOS driver input pins Non-inverting driver output pin 2, 6 DOUT− Inverting driver output pin 5 GND Ground pin 1 VCC Positive power supply pin, +5.0V ± 10% Truth Table (1) (1) 6 DIN DOUT+ DOUT− L L H H H L DIN > 0.8V and DIN < 2.
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NRND DS90C401 www.ti.com SNLS002C – JUNE 1998 – REVISED APRIL 2013 Typical Performance Characteristics Power Supply Current vs Power Supply Voltage Power Supply Current vs Temperature Figure 6. Figure 7. Power Supply Current vs Power Supply Voltage Power Supply Current vs Temperature Figure 8. Figure 9. Output Short Circuit Current vs Power Supply Voltage Differential Output Voltage vs Power Supply Voltage Figure 10. Figure 11.
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NRND DS90C401 SNLS002C – JUNE 1998 – REVISED APRIL 2013 www.ti.com Typical Performance Characteristics (continued) 8 Differential Output Voltage vs Ambient Temperature Output Voltage High vs Power Supply Voltage Figure 12. Figure 13. Output Voltage High vs Ambient Temperature Output Voltage Low vs Power Supply Voltage Figure 14. Figure 15. Output Voltage Low vs Ambient Temperature Offset Voltage vs Power Supply Voltage Figure 16. Figure 17.
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NRND DS90C401 www.ti.com SNLS002C – JUNE 1998 – REVISED APRIL 2013 Typical Performance Characteristics (continued) Offset Voltage vs Ambient Temperature Power Supply Current vs Frequency Figure 18. Figure 19. Differential Output Voltage vs Load Resistor Differential Propagation Delay vs Power Supply Voltage Figure 20. Figure 21. Differential Propagation Delay vs Ambient Temperature Differential Skew vs Power Supply Voltage Figure 22. Figure 23.
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NRND DS90C401 SNLS002C – JUNE 1998 – REVISED APRIL 2013 www.ti.com Typical Performance Characteristics (continued) Differential Skew vs Ambient Temperature Differential Transition Time vs Power Supply Voltage Figure 24. Figure 25. Differential Transition Time vs Ambient Temperature Figure 26.
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NRND DS90C401 www.ti.com SNLS002C – JUNE 1998 – REVISED APRIL 2013 REVISION HISTORY Changes from Revision B (April 2013) to Revision C • Page Changed layout of National Data Sheet to TI format ............................................................................................................
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.com 1-Nov-2013 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties.
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PACKAGE MATERIALS INFORMATION www.ti.com 11-Oct-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant DS90C401MX SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 DS90C401MX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.
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PACKAGE MATERIALS INFORMATION www.ti.com 11-Oct-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DS90C401MX SOIC D 8 2500 367.0 367.0 35.0 DS90C401MX/NOPB SOIC D 8 2500 367.0 367.0 35.
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