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DS90CP22

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SNLS053E –MARCH 2000–REVISED APRIL 2013

DS90CP22 800 Mbps 2x2 LVDS Crosspoint Switch

Check for Samples: DS90CP22

FEATURES

DESCRIPTION

DS90CP22 is a 2x2 crosspoint switch utilizing LVDS

• DC - 800 Mbps Low Jitter, Low Skew Operation

(Low Voltage Differential Signaling) technology for

• 65 ps (typ) of Pk-Pk Jitter with PRBS = 2

−1

low power, high speed operation. Data paths are fully

Data Pattern at 800 Mbps

differential from input to output for low noise

• Single +3.3 V Supply

generation and low pulse width distortion. The non-

blocking design allows connection of any input to any

• Less than 330 mW (typ) Total Power

output or outputs. LVDS I/O enable high speed data

Dissipation

transmission for point-to-point interconnects. This

• Non-Blocking "'Switch Architecture"'

device can be used as a high speed differential

• Balanced Output Impedance

crosspoint, 2:1 mux, 1:2 demux, repeater or 1:2

signal splitter. The mux and demux functions are

• Output Channel-to-Channel Skew is 35 ps (typ)

useful for switching between primary and backup

• Configurable as 2:1 mux, 1:2 demux, Repeater

circuits in fault tolerant systems. The 1:2 signal

or 1:2 Signal Splitter

splitter and 2:1 mux functions are useful for

• LVDS Receiver Inputs Accept LVPECL Signals distribution of serial bus across several rack-mounted

backplanes.

• Fast Switch Time of 1.2ns (typ)

The DS90CP22 accepts LVDS signal levels, LVPECL

• Fast Propagation Delay of 1.3ns (typ)

levels directly or PECL with attenuation networks.

• Receiver Input Threshold < ±100 mV

The individual LVDS outputs can be put into TRI-

• Available in 16 Lead TSSOP and SOIC

STATE by use of the enable pins.

Packages

• Conforms to ANSI/TIA/EIA-644-1995 LVDS For more details, please refer to the Application

Information section of this datasheet.

Standard

• Operating Temperature: −40°C to +85°C

Connection Diagram

Figure 1. SOIC-16 Package

TSSOP-16 Package

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2All trademarks are the property of their respective owners.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (17 pages)

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DS90CP22 www.ti.com SNLS053E – MARCH 2000 – REVISED APRIL 2013 DS90CP22 800 Mbps 2x2 LVDS Crosspoint Switch Check for Samples: DS90CP22 FEATURES DESCRIPTION • • DS90CP22 is a 2x2 crosspoint switch utilizing LVDS (Low Voltage Differential Signaling) technology for low power, high speed operation. Data paths are fully differential from input to output for low noise generation and low pulse width distortion. The nonblocking design allows connection of any input to any output or outputs.
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DS90CP22 SNLS053E – MARCH 2000 – REVISED APRIL 2013 www.ti.com Figure 2. Diff. Output Eye-Pattern in 1:2 split mode @ 800 Mbps Conditions: 3.3 V, PRBS = 223−1 data pattern, VID = 300mV, VCM = +1.2 V, 200 ps/div, 100 mV/div These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) (2) −0.3V to +4V Supply Voltage (VCC) −0.
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DS90CP22 www.ti.com SNLS053E – MARCH 2000 – REVISED APRIL 2013 Electrical Characteristics (1) Over recommended operating supply and temperature ranges unless otherwise specified Symbol Parameter Conditions Min Typ Max Units V CMOS/TTL DC SPECIFICATIONS (EN0,EN1,SEL0,SEL1) VIH High Level Input Voltage 2.0 VCC VIL Low Level Input Voltage GND 0.8 V IIH High Level Input Current VIN = 3.6V or 2.0V; VCC = 3.6V +20 μA IIL Low Level Input Current VIN = 0V or 0.8V; VCC = 3.
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DS90CP22 SNLS053E – MARCH 2000 – REVISED APRIL 2013 www.ti.com AC Electrical Characteristics (continued) Over recommended operating supply and temperature ranges unless otherwise specified(1) Symbol Parameter Conditions TJIT Max Units 40 90 ps 65 120 ps 0.9 1.3 1.6 ns 1.0 1.3 1.5 ns 0.9 1.3 1.6 ns 1.0 23 VID = 300mV; PRBS=2 -1 data pattern; VCM = 1.
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DS90CP22 www.ti.com SNLS053E – MARCH 2000 – REVISED APRIL 2013 Figure 5. Output active to TRI-STATE and TRI-STATE to active output time Figure 6. LVDS Output Load Figure 7. LVDS Output Transition Time Figure 8.
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DS90CP22 SNLS053E – MARCH 2000 – REVISED APRIL 2013 www.ti.com Figure 9.
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DS90CP22 www.ti.com SNLS053E – MARCH 2000 – REVISED APRIL 2013 APPLICATION INFORMATION MODES OF OPERATION The DS90CP22 provides three modes of operation. In the 1:2 splitter mode, the two outputs are copies of the same single input. This is useful for distribution / fan-out applications. In the repeater mode, the device operates as a 2 channel LVDS buffer. Repeating the signal restores the LVDS amplitude, allowing it to drive another media segment.
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DS90CP22 SNLS053E – MARCH 2000 – REVISED APRIL 2013 www.ti.com COMPATIBILITY WITH LVDS STANDARD The DS90CP22 is compatible with LVDS and Bus LVDS Interface devices. It is enhanced over standard LVDS drivers in that it is able to driver lower impedance loads with standard LVDS levels. Standard LVDS drivers provide 330mV differential output with a 100Ω load. The DS90CP22 provides 365mV with a 75Ω load or 400mV with 100Ω loads. This extra drive capability is useful in certain multidrop applications.
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DS90CP22 www.ti.com SNLS053E – MARCH 2000 – REVISED APRIL 2013 Typical Performance Characteristics Diff. Output Voltage (VOD) vs. Resistive Load (RT) Peak-to-Peak Output Jitter at VCM = +0.4V vs. VID Figure 10. Figure 11. Peak-to-Peak Output Jitter at VCM = +1.2V vs. VID Peak-to-Peak Output Jitter at VCM = +1.6V vs. VID Figure 12. Figure 13.
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DS90CP22 SNLS053E – MARCH 2000 – REVISED APRIL 2013 www.ti.com REVISION HISTORY Changes from Revision D (April 2013) to Revision E • 10 Page Changed layout of National Data Sheet to TI format ............................................................................................................
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.com 1-Nov-2013 (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.
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PACKAGE MATERIALS INFORMATION www.ti.com 11-Oct-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant DS90CP22MTX/NOPB TSSOP PW 16 2500 330.0 12.4 6.95 8.3 1.6 8.0 12.0 Q1 DS90CP22MX-8/NOPB SOIC D 16 2500 330.0 16.4 6.5 10.3 2.3 8.0 16.
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PACKAGE MATERIALS INFORMATION www.ti.com 11-Oct-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DS90CP22MTX/NOPB TSSOP PW 16 2500 367.0 367.0 35.0 DS90CP22MX-8/NOPB SOIC D 16 2500 367.0 367.0 35.
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