Datasheet

ManualsBrandsTEXAS INSTRUMENTS ManualsInterface ICsInterface IC - drivers LVDS 2/0 SOIC 8

DS90LV027A

www.ti.com

SNLS026C –MARCH 2000–REVISED APRIL 2013

DS90LV027A LVDS Dual High Speed Differential Driver

Check for Samples: DS90LV027A

FEATURES

DESCRIPTION

The DS90LV027A is a dual LVDS driver device

• >600 Mbps (300MHz) Switching Rates

optimized for high data rate and low power

• 0.3 ns Typical Differential Skew

applications. The device is designed to support data

• 0.7 ns Maximum Differential Skew

rates in excess of 600Mbps (300MHz) utilizing Low

Voltage Differential Signaling (LVDS) technology. The

• 1.5 ns Maximum Propagation Delay

DS90LV027A is a current mode driver allowing power

• 3.3V Power Supply Design

dissipation to remain low even at high frequency. In

• ±360 mV Differential Signaling

addition, the short circuit fault current is also

minimized.

• Low Power Dissipation (46 mW @ 3.3V Static)

• Flow-Through Design Simplifies PCB Layout

The device is in a 8-lead SOIC package. The

DS90LV027A has a flow-through design for easy

• Interoperable with Existing 5V LVDS Devices

PCB layout. The differential driver outputs provides

• Power Off Protection (Outputs in High

low EMI with its typical low output swing of 360 mV. It

Impedance)

is perfect for high speed transfer of clock and data.

• Conforms to TIA/EIA-644 Standard

The DS90LV027A can be paired with its companion

dual line receiver, the DS90LV028A, or with any of

• 8-Lead SOIC Package Saves Space

TI's LVDS receivers, to provide a high-speed point-to-

• Industrial Temperature Operating Range

point LVDS interface.

– (−40°C to +85°C)

Connection Diagram

Figure 1. Dual-In-Line

See Package Number D (R-PDSO-G8)

Functional Diagram

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2All trademarks are the property of their respective owners.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (14 pages)

PAGE 1
DS90LV027A www.ti.com SNLS026C – MARCH 2000 – REVISED APRIL 2013 DS90LV027A LVDS Dual High Speed Differential Driver Check for Samples: DS90LV027A FEATURES DESCRIPTION • • • • • • • • • • The DS90LV027A is a dual LVDS driver device optimized for high data rate and low power applications. The device is designed to support data rates in excess of 600Mbps (300MHz) utilizing Low Voltage Differential Signaling (LVDS) technology.
PAGE 2
DS90LV027A SNLS026C – MARCH 2000 – REVISED APRIL 2013 www.ti.com Absolute Maximum Ratings (1) −0.3V to +4V Supply Voltage (VCC) −0.3V to +3.6V Input Voltage (DI) −0.3V to +3.9V Output Voltage (DO±) Maximum Package Power Dissipation @ +25°C D Package 1190 mW Derate D Package 9.5 mW/°C above +25°C −65°C to +150°C Storage Temperature Range Lead Temperature Range Soldering (4 sec.) +260°C ≥ 8kV HBM 1.
PAGE 3
DS90LV027A www.ti.com SNLS026C – MARCH 2000 – REVISED APRIL 2013 Switching Characteristics Over Supply Voltage and Operating Temperature Ranges, unless otherwise specified (1) (2) (3) (4) Symbol Parameter Conditions Min Typ Max Units DIFFERENTIAL DRIVER CHARACTERISTICS tPHLD Differential Propagation Delay High to Low RL = 100Ω, CL = 15 pF 0.3 0.8 1.5 ns tPLHD Differential Propagation Delay Low to High (Figure 3 and Figure 4) 0.3 1.1 1.
PAGE 4
DS90LV027A SNLS026C – MARCH 2000 – REVISED APRIL 2013 www.ti.com Parameter Measurement Information Figure 2. Differential Driver DC Test Circuit Figure 3. Differential Driver Propagation Delay and Transition Time Test Circuit Figure 4. Differential Driver Propagation Delay and Transition Time Waveforms APPLICATION INFORMATION Table 1.
PAGE 5
DS90LV027A www.ti.com SNLS026C – MARCH 2000 – REVISED APRIL 2013 Typical Performance Curves Output High Voltage vs Power Supply Voltage Output Low Voltage vs Power Supply Voltage Figure 5. Figure 6. Output Short Circuit Current vs Power Supply Voltage Differential Output Voltage vs Power Supply Voltage Figure 7. Figure 8. Differential Output Voltage vs Load Resistor Offset Voltage vs Power Supply Voltage Figure 9. Figure 10.
PAGE 6
DS90LV027A SNLS026C – MARCH 2000 – REVISED APRIL 2013 www.ti.com Typical Performance Curves (continued) 6 Power Supply Current vs Frequency Power Supply Current vs Power Supply Voltage Figure 11. Figure 12. Power Supply Current vs Ambient Temperature Differential Propagation Delay vs Power Supply Voltage Figure 13. Figure 14. Differential Propagation Delay vs Ambient Temperature Differential Skew vs Power Supply Voltage Figure 15. Figure 16.
PAGE 7
DS90LV027A www.ti.com SNLS026C – MARCH 2000 – REVISED APRIL 2013 Typical Performance Curves (continued) Differential Skew vs Ambient Temperature Transition Time vs Power Supply Voltage Figure 17. Figure 18. Transition Time vs Ambient Temperature Figure 19.
PAGE 8
DS90LV027A SNLS026C – MARCH 2000 – REVISED APRIL 2013 www.ti.com REVISION HISTORY Changes from Revision B (April 2013) to Revision C • 8 Page Changed layout of National Data Sheet to TI format ............................................................................................................
PAGE 9
PACKAGE OPTION ADDENDUM www.ti.
PAGE 10
PACKAGE OPTION ADDENDUM www.ti.com 1-Nov-2013 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties.
PAGE 11
PACKAGE MATERIALS INFORMATION www.ti.com 11-Oct-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant DS90LV027ATMX SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 DS90LV027ATMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.
PAGE 12
PACKAGE MATERIALS INFORMATION www.ti.com 11-Oct-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DS90LV027ATMX SOIC D 8 2500 367.0 367.0 35.0 DS90LV027ATMX/NOPB SOIC D 8 2500 367.0 367.0 35.
PAGE 13
PAGE 14
IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.