Datasheet

ManualsBrandsTEXAS INSTRUMENTS ManualsInterface ICsInterface IC - transceivers LVDS 1/1 SOIC 8

CLK1A (8 KHz)

CLK1B (8 KHz)

CLK2A (19.44 MHz)

CLK2B (19.44 MHz)

CLK3A (User Defined up to 100 MHz)

CLK3B (User Defined up to 100 MHz)

80:R

ATCA Backplane

Slot Card N Slot Card N+1

MLVDS Transceivers

DS91C176, DS91D176

www.ti.com

SNLS146L –MARCH 2006–REVISED APRIL 2013

DS91D176/DS91C176 100 MHz Single Channel M-LVDS Transceivers

Check for Samples: DS91C176, DS91D176

FEATURES

DESCRIPTION

The DS91C176 and DS91D176 are 100 MHz single

• DC to 100+ MHz / 200+ Mbps Low Power, Low

channel M-LVDS (Multipoint Low Voltage Differential

EMI Operation

Signaling) transceivers designed for applications that

• Optimal for ATCA, uTCA Clock Distribution

utilize multipoint networks (e.g. clock distribution in

Networks

ATCA and uTCA based systems). M-LVDS is a new

bus interface standard (TIA/EIA-899) optimized for

• Meets or Exceeds TIA/EIA-899 M-LVDS

multidrop networks. Controlled edge rates, tight input

Standard

receiver thresholds and increased drive strength are

• Wide Input Common Mode Voltage for

sone of the key enhancements that make M-LVDS

Increased Noise Immunity

devices an ideal choice for distributing signals via

• DS91D176 has Type 1 Receiver Input

multipoint networks.

• DS91C176 has Type 2 Receiver with Fail-safe

The DS91C176/DS91D176 are half-duplex

• Industrial Temperature Range

transceivers that accept LVTTL/LVCMOS signals at

the driver inputs and convert them to differential M-

• Space Saving SOIC-8 Package

LVDS signals. The receiver inputs accept low voltage

differential signals (LVDS, B-LVDS, M-LVDS, LV-

PECL and CML) and convert them to 3V LVCMOS

signals. The DS91D176 has a M-LVDS type 1

receiver input with no offset. The DS91C176 has an

M-LVDS type 2 receiver which enable failsafe

functionality.

Typical Application in an ATCA Clock Distribution Network

Figure 1. System Diagram

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2All trademarks are the property of their respective owners.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (19 pages)

PAGE 1
DS91C176, DS91D176 www.ti.com SNLS146L – MARCH 2006 – REVISED APRIL 2013 DS91D176/DS91C176 100 MHz Single Channel M-LVDS Transceivers Check for Samples: DS91C176, DS91D176 FEATURES DESCRIPTION • The DS91C176 and DS91D176 are 100 MHz single channel M-LVDS (Multipoint Low Voltage Differential Signaling) transceivers designed for applications that utilize multipoint networks (e.g. clock distribution in ATCA and uTCA based systems).
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DS91C176, DS91D176 SNLS146L – MARCH 2006 – REVISED APRIL 2013 www.ti.com Connection and Logic Diagram Top View Figure 2. SOIC Package See Package Number D0008A M-LVDS Receiver Types The EIA/TIA-899 M-LVDS standard specifies two different types of receiver input stages. A type 1 receiver has a conventional threshold that is centered at the midpoint of the input amplitude, VID/2. A type 2 receiver has a built in offset that is 100mV greater than VID/2.
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DS91C176, DS91D176 www.ti.com SNLS146L – MARCH 2006 – REVISED APRIL 2013 Absolute Maximum Ratings (1) (2) −0.3V to +4V Supply Voltage, VCC Control Input Voltages −0.3V to (VCC + 0.3V) Driver Input Voltage −0.3V to (VCC + 0.3V) −1.8V to +4.1V Driver Output Voltages Receiver Input Voltages −1.8V to +4.1V Receiver Output Voltage −0.3V to (VCC + 0.3V) Maximum Package Power Dissipation at +25°C SOIC Package 833 mW Derate SOIC Package 6.67 mW/°C above +25°C Thermal Resistance (4-Layer, 2 oz.
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DS91C176, DS91D176 SNLS146L – MARCH 2006 – REVISED APRIL 2013 www.ti.com Electrical Characteristics (continued) Over recommended operating supply and temperature ranges unless otherwise specified. (1) (2) (3) (4) Parameter Test Conditions VP(H) Voltage overshoot, low-to-high level output VP(L) Voltage overshoot, high-to-low level output Min RL = 50Ω, CL = 5pF,CD = 0.5pF See Figure 9 and Figure 10 (5) Typ Max Units 1.2VSS V −0.2V V SS -15 15 μA VIL = 0.8V -15 15 μA IIN = -18mA -1.
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DS91C176, DS91D176 www.ti.com SNLS146L – MARCH 2006 – REVISED APRIL 2013 Electrical Characteristics (continued) Over recommended operating supply and temperature ranges unless otherwise specified. (1) (2) (3) (4) Parameter Test Conditions Min Typ Max Units SUPPLY CURRENT (VCC) ICCD Driver Supply Current RL = 50Ω, DE = VCC, RE = VCC 20 29.5 mA ICCZ TRI-STATE Supply Current DE = GND, RE = VCC 6 9.0 mA ICCR Receiver Supply Current DE = GND, RE = GND 14 18.5 mA Min Typ Max Units 1.
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DS91C176, DS91D176 SNLS146L – MARCH 2006 – REVISED APRIL 2013 www.ti.com Test Circuits and Waveforms Figure 4. Differential Driver Test Circuit A ~ 2.1V B ~ 1.5V 'VOS(SS) VOS VOS(PP) Figure 5. Differential Driver Waveforms Figure 6. Differential Driver Full Load Test Circuit Figure 7.
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DS91C176, DS91D176 www.ti.com SNLS146L – MARCH 2006 – REVISED APRIL 2013 Figure 8. Differential Driver Short-Circuit Test Circuit Figure 9. Driver Propagation Delay and Transition Time Test Circuit Figure 10. Driver Propagation Delays and Transition Time Waveforms Figure 11.
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DS91C176, DS91D176 SNLS146L – MARCH 2006 – REVISED APRIL 2013 www.ti.com Figure 12. Driver TRI-STATE Delay Waveforms Figure 13. Receiver Propagation Delay and Transition Time Test Circuit Figure 14.
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DS91C176, DS91D176 www.ti.com SNLS146L – MARCH 2006 – REVISED APRIL 2013 Figure 15. Type 2 Receiver Propagation Delay and Transition Time Waveforms Figure 16. Receiver TRI-STATE Delay Test Circuit Figure 17. Receiver TRI-STATE Delay Waveforms FUNCTION TABLES Table 1. DS91D176/DS91C176 Transmitting (1) Inputs (1) Outputs RE DE D B A X 2.0V 2.0V L H X 2.0V 0.8V H L X 0.
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DS91C176, DS91D176 SNLS146L – MARCH 2006 – REVISED APRIL 2013 www.ti.com Table 2. DS91D176 Receiving (1) Inputs (1) Output RE DE A−B R 0.8V 0.8V ≥ +0.05V H 0.8V 0.8V ≤ −0.05V L 0.8V 0.8V 0V X 2.0V 0.8V X Z X — Don't care condition Z — High impedance state Table 3. DS91C176 Receiving (1) Inputs (1) Output RE DE A−B R 0.8V 0.8V ≥ +0.15V H 0.8V 0.8V ≤ +0.05V L 0.8V 0.8V 0V L 2.0V 0.8V X Z X — Don't care condition Z — High impedance state Table 4.
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DS91C176, DS91D176 www.ti.com SNLS146L – MARCH 2006 – REVISED APRIL 2013 PIN DESCRIPTONS Pin No. Name Description 1 R 2 RE Receiver output pin Receiver enable pin: When RE is high, the receiver is disabled. When RE is low or open, the receiver is enabled. 3 DE Driver enable pin: When DE is low, the driver is disabled. When DE is high, the driver is enabled.
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DS91C176, DS91D176 SNLS146L – MARCH 2006 – REVISED APRIL 2013 www.ti.com Typical Performance Characteristics – DS91D176/DS91C176 Supply Current vs. Frequency Output VOD vs. Load Resistance Supply Current measured using a clock pattern with driver terminated VCC = 3.3V, TA = +25°C to 50ohms . VCC = 3.3V, TA = +25°C. Figure 18. 12 Submit Documentation Feedback Figure 19.
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DS91C176, DS91D176 www.ti.com SNLS146L – MARCH 2006 – REVISED APRIL 2013 REVISION HISTORY Changes from Revision K (April 2013) to Revision L • Page Changed layout of National Data Sheet to TI format ..........................................................................................................
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.com 1-Nov-2013 (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.
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PACKAGE MATERIALS INFORMATION www.ti.com 11-Oct-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant DS91C176TMAX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 DS91D176TMAX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.
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PACKAGE MATERIALS INFORMATION www.ti.com 11-Oct-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DS91C176TMAX/NOPB SOIC D 8 2500 367.0 367.0 35.0 DS91D176TMAX/NOPB SOIC D 8 2500 367.0 367.0 35.
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