MSP-EXPCC430RFx Experimenter Kit ECCN 5A002A1A User's Guide Literature Number: SLAU460 November 2012
Contents 1 MSP-EXPCC430RFx Experimenter Kit Overview ...................................................................... 4 6 7 .................................................................................................................. 4 1.2 Kit Contents .............................................................................................................. 8 Getting Started With the MSP-EXPCC430RFx Experimenter Kit ................................................ 8 2.
www.ti.com List of Figures 1 MSP-EXPCC430RFx Experimenter Kit – MSP-EXP430F6137Rx Base Board (Front)............................ 5 2 MSP-EXPCC430RFx Experimenter Kit – MSP-EXP430F6137Rx Base Board (Back) ............................ 6 3 MSP-EXPCC430RFx Experimenter Kit – MSP-EXP430F5137Rx Satellite Board (Front) ........................ 7 4 MSP-EXPCC430RFx Experimenter Kit – MSP-EXP430F5137Rx Satellite Board (Back) 5 MSP-EXP430F6137Rx Base Board Hardware ...........................................
User's Guide SLAU460 – November 2012 MSP-EXPCC430RFx Experimenter Kit User’s Guide 1 MSP-EXPCC430RFx Experimenter Kit Overview 1.1 Overview The MSP-EXPCC430RFx Experimenter Kit is the complete sub-GHz development platform for the CC430 devices from the MSP430™ family. The kit provides two sub-GHz wireless modules: the MSPEXP430F6137Rx Base Board with the CC430F6137, and the MSP-EXP430F5137Rx Satellite Board with the CC430F5137.
www.ti.com MSP-EXPCC430RFx Experimenter Kit Overview Figure 1.
MSP-EXPCC430RFx Experimenter Kit Overview www.ti.com Figure 2.
www.ti.com MSP-EXPCC430RFx Experimenter Kit Overview Figure 3. MSP-EXPCC430RFx Experimenter Kit – MSP-EXP430F5137Rx Satellite Board (Front) Figure 4. MSP-EXPCC430RFx Experimenter Kit – MSP-EXP430F5137Rx Satellite Board (Back) The MSP-EXPCC430RFx Experimenter Kit is available for purchase from the TI eStore.
Getting Started With the MSP-EXPCC430RFx Experimenter Kit www.ti.com The MSP-EXPCC430RFx Experimenter Kit features the RF System-on-Chip CC430 devices, CC430F6137 with LCD driver and CC430F5137. This combination of devices enables sub-GHz RF communication on the ultra-low-power MCU platform. The CC430 devices allow for high-performance radio with high sensitivity and excellent blocking, while minimizing the number of external components by integrating the solution into a single-chip MCU platform. 1.
Getting Started With the MSP-EXPCC430RFx Experimenter Kit www.ti.com 2.1.3 Prepare the MSP-EXPCC430RFx Experimenter Kit for Operation 2.1.3.1 Base Board MSP-EXP430F6137Rx 1. Select the power switch configuration to match the power supply in use (an external DC power supply, batteries, or the USB connector). 2. If the batteries option is selected, insert the two AA batteries provided with the kit into the sockets on the back on the MSP-EXP430F6137Rx base board.
Getting Started With the MSP-EXPCC430RFx Experimenter Kit 2.3 www.ti.com MSP-EXPCC430RFx User Experience The MSP-EXPCC430RFx User Experience includes two projects: 1. Firmware applications that are pre-loaded on the MSP-EXP430F6137Rx Base Board and the MSPEXP430F5137Rx Satellite Board to demonstrate a stand-alone wireless network using the SimpliciTI protocol. 2.
Getting Started With the MSP-EXPCC430RFx Experimenter Kit www.ti.com 2.5 CC430 Wireless Network GUI The included CC430 Wireless Network GUI is designed to provide more detailed information as well as visual presentation of the network and device information. The GUI requires a PC USB connection from the MSP-EXPF6137Rx Base Board. The Base Board captures all status and sensor information from the devices (including the AP itself) and relays the prepared packets to the PC GUI.
MSP-EXPCC430RFx Experimenter Kit Hardware 3 MSP-EXPCC430RFx Experimenter Kit Hardware 3.1 MSP-EXP430F6137Rx Hardware Description www.ti.com Figure 5. MSP-EXP430F6137Rx Base Board Hardware 3.2 MSP-EXP430F5137Rx Hardware Description Figure 6.
MSP-EXPCC430RFx Experimenter Kit Hardware www.ti.com 3.3 Schematics Figure 7.
MSP-EXPCC430RFx Experimenter Kit Hardware www.ti.com Figure 8.
MSP-EXPCC430RFx Experimenter Kit Hardware www.ti.com Figure 9.
MSP-EXPCC430RFx Experimenter Kit Hardware www.ti.com Figure 10.
www.ti.com 3.4 MSP-EXPCC430RFx Experimenter Kit Hardware PCB Layout Figure 11.
MSP-EXPCC430RFx Experimenter Kit Hardware www.ti.com Figure 12.
MSP-EXPCC430RFx Experimenter Kit Firmware www.ti.com 4 MSP-EXPCC430RFx Experimenter Kit Firmware This section describes the firmware applications provided with the project. Detailed information on the project construction, the use of the 5xx/6xx Core Library, the use of the TI's SimpliciTI RF stack, and how to set up and import the projects is included. Source code for the CC430F6137 and the CC430F5137 firmware application is installed to the [INSTALL_PATH]\src\ folder as described in Section 2.2. 4.
MSP-EXPCC430RFx Experimenter Kit Software www.ti.com On the MSP-EXP430F5137Rx Satellite Board, two types of packets, heartbeat and alert, are prepared for SimpliciTI transmissions. The MSP-EXP430F6137Rx Base Board running the AP stack is configured to expect and process these two types of packets accordingly. 4.5 5xx/6xx Core Libraries The CC430 devices are a member of the MSP430 5xx/6xx family devices.
Bills of Materials (BOM) www.ti.com 7 Bills of Materials (BOM) Table 1. MSP-EXP430F6137R9 Base Board (HW-V2.1) BOM Part Value Toleran ce Package Manufacturer Details Distributor Part No. Johanson Technology 500R07S2R2BV4T Johanson Technology 500R07S2R2BV4T Capacitors C1 n.m. C0402 C2 n.m. C0402 C3 2.
Bills of Materials (BOM) www.ti.com Table 1. MSP-EXP430F6137R9 Base Board (HW-V2.1) BOM (continued) Part Value Toleran ce Package Manufacturer Details Distributor Part No. C49 2.2nF ±0,25pF C0402 C50 1pF ±0,25pF C0402 C51 1.5pF ±0,25pF C0402 C52 100pF 10% C0402 C53 1.5pF ±0,25pF C0402 C54 1.5pF ±0,25pF C0402 C55 6.8pF ±0,25pF C0402 C56 n.m. C0402 D1 1N4148WT SOD523 D2 n.m.
Bills of Materials (BOM) www.ti.com Table 1. MSP-EXP430F6137R9 Base Board (HW-V2.1) BOM (continued) Part Value Toleran ce Package R23 47kR 1% R0402 R24 3.3kR 1% R0402 R25 3.3kR 1% R0402 R26 100kR 1% R0402 R27 100kR 1% R0402 R28 33kR 1% R0402 R29 10kR 1% R0402 R30 47kR 1% R0402 R31 100R 1% R0402 R32 270R 1% R0402 R33 56kR 1% R0402 R34 0R 1% R0402 R35 56kR 1% R0402 R36 47kR 1% R0402 R37 0R 1% R0402 Manufacturer Details Distributor Part No.
Bills of Materials (BOM) www.ti.com Table 1. MSP-EXP430F6137R9 Base Board (HW-V2.1) BOM (continued) Part Value Q1 Toleran ce Package Manufacturer FT10A-12,0/16-3030/27 5032-4PIN Coftech Q2 CTA531-26.000-1610/10/A NX5032 Compotek hf crystal CTA531-26.000-1610/10/A Q3 CC7VT1A_32,768kHz_12, 5pF 3216 Micro Crystal watch crystal CC7VT1A_32,768kHz_12, 5pF T1 SI2323DS SOT23-3 Vishay P-Channel 20-V MOSFET T2 SI2323DS SOT23-3 Vishay P-Channel 20-V MOSFET P1 n.m.
Bills of Materials (BOM) www.ti.com Table 2. MSP-EXP430F5137R9T Satellite Board (HW-V2.0) BOM Part Value Tolerance Package Manufacturer Details Distributor Part No. Capacitors C1 100uF C1210 C2 n.m. C0402 C3 n.m. C0402 C4 n.m.
Bills of Materials (BOM) www.ti.com Table 3. MSP-EXP430F6137R4 Base Board (HW-V2.1) BOM Part Value Tol. Package Manufacturer or Comments Distributor Part No. C1 2.2pF ±0,25pF C0402 Johanson Technology specific for 433MHz var ***R4 500R07S2R2BV4T C2 n.m. C0402 C3 n.m.
Bills of Materials (BOM) www.ti.com Table 3. MSP-EXP430F6137R4 Base Board (HW-V2.1) BOM (continued) Part Value Tol. Package Manufacturer or Comments Distributor Part No. C49 2.
Bills of Materials (BOM) www.ti.com Table 3. MSP-EXP430F6137R4 Base Board (HW-V2.1) BOM (continued) Part Value Tol. Package R19 1.5kR 1% R0402 R20 100R 1% R0402 R21 15kR 1% R0402 R22 47kR 1% R0402 R23 47kR 1% R0402 R24 3.3kR 1% R0402 R25 3.
Bills of Materials (BOM) www.ti.com Table 3. MSP-EXP430F6137R4 Base Board (HW-V2.1) BOM (continued) Part Value LED4 Tol. Package Manufacturer or Comments Distributor Part No. APT1608SRCPRV(red ) LED0603 Kingbright APT1608SRCPRV Q1 FT10A-12,0/16-3030/27 5032-4PIN Coftech Q2 CTA531-26.000-1610/10/A NX5032 Compotek hf crystal CTA531-26.
Bills of Materials (BOM) www.ti.com Table 4. MSP-EXP430F5137R4T Satellite Board (HW-V2.0) BOM Part Value Tol. Package Manufacturer Details Distributor Part No. Capacitors C1 100uF C1210 C2 3,3pF C0402 C3 n.m. C0402 C4 n.m. C0402 470 R0402 SW1 B3U-1000P B3U-1000P Omron SW2 B3U-1000P B3U-1000P Omron MODUL1 A45201101 CON1 10X2_SAMTEC_F Samtec 10x2, female SFM-110-02-S-D-AK CON2 10X2_SAMTEC_F Samtec 10x2, female SFM-110-02-S-D-AK CON3 22-03-5035 1x3, 2.
EVALUATION BOARD/KIT/MODULE (EVM) ADDITIONAL TERMS Texas Instruments (TI) provides the enclosed Evaluation Board/Kit/Module (EVM) under the following conditions: The user assumes all responsibility and liability for proper and safe handling of the goods. Further, the user indemnifies TI from all claims arising from the handling or use of the goods.
FCC Interference Statement for Class B EVM devices This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications.
【Important Notice for Users of this Product in Japan】 】 This development kit is NOT certified as Confirming to Technical Regulations of Radio Law of Japan If you use this product in Japan, you are required by Radio Law of Japan to follow the instructions below with respect to this product: 1. 2. 3. Use this product in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal Affairs and Communications on March 28, 2006, based on Sub-section 1.
EVALUATION BOARD/KIT/MODULE (EVM) WARNINGS, RESTRICTIONS AND DISCLAIMERS For Feasibility Evaluation Only, in Laboratory/Development Environments. Unless otherwise indicated, this EVM is not a finished electrical equipment and not intended for consumer use.
