- Texas Instrument User's Guide Crosspoint Switch HPL-D SLLU064A

3-8

3.3 PCB Fabrication Requirements and Stack Up

Stackup

Signal: Layer 1

Notes:

1. PWB TO BE FABRICATED TO MEET OR EXCEED IPC-6012,

CLASS 3 STANDARDS AND WORKMANSHIP SHALL

CONFORM TO IPC-A-600, CLASS 3 CURRENT REVISIONS

2. BOARD MATERIAL AND CONSTRUCTION TO BE UL

APPROVED AND MARKED ON THE FINISHED BOARD.

3. LAMINATE MATERIAL:COPPER-CLAD NELCO N4000-13 (DO NOT USE -13SI)

4. COPPER WEIGHT: 1oz FINISHED

5. FINISHED THICKNESS: 0.062" +/- 0.010"

6. MIN PLATING THICKNESS IN THROUGH HOLES: .001"

7. SMOBC / HASL

8. LPI SOLDERMASK BOTH SIDES USING APPROPRIATE

LAYER ARTWORK: COLOR = GREEN

9. LPI SILKSCREEN AS REQUIRED: COLOR = WHITE

10. VENDOR INFORMATION TO BE INCORPORATED ON BACK SIDE

WHENEVER POSSIBLE

11. MINIMUM COPPER CONDUCTOR WIDTH IS: 0.009"

MINIMUM CONDUCTOR SPACING IS: 0.006"

12. NUMBER OF FINISHED LAYERS: 6

13. ALL 8 MIL HOLES TO BE PLUGGED AND COPLANAR TO

SURFACE

14. SPACING BETWEEN LAYERS 1 AND 2 SHOULD BE 0.0075"

SPACING BETWEEN LAYERS 2 AND 3 SHOULD BE 0.0075"

SPACING BETWEEN LAYERS 4 AND 5 SHOULD BE 0.0075"

SPACING BETWEEN LAYERS 5 AND 6 SHOULD BE 0.0075"

GND: Layer 2

VCC Power: Layer 3

GND: Layer 5

0.0075"

VCCO1 Power: Layer 4

SIGNAL/GND: Layer 6

0.0075"

0.062"