Datasheet

INA282, INA283
INA284, INA285
INA286
SBOS485B –NOVEMBER 2009–REVISED SEPTEMBER 2012 www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PACKAGE/ORDERING INFORMATION
(1)
PACKAGE PACKAGE
PRODUCT GAIN PACKAGE DESIGNATOR MARKING
INA282 50V/V SOIC-8 D I282A
INA283 200V/V SOIC-8 D I283A
INA284 500V/V SOIC-8 D I284A
INA285 1000V/V SOIC-8 D I285A
INA286 100V/V SOIC-8 D I286A
(1) For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet, or
refer to the device product folder at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
(1)
Over operating free-air temperature range, unless otherwise noted.
INA282, INA283,
INA284, INA285, INA286 UNIT
Supply Voltage +18 V
Differential (V
+IN
) – (V
–IN
)
(3)
–5 to +5 V
Analog Inputs,
V
+IN
, V
–IN
(2)
Common-Mode –14 to +80 V
Ref1, Ref2, Out GND–0.3 to (V+) + 0.3 V
Input Current into Any Pin 5 mA
Storage Temperature –65 to +150 °C
Junction Temperature +150 °C
Human Body Model (HBM) 3000 V
ESD Ratings: Charged-Device Model (CDM) 1000 V
Machine Model (MM) 200 V
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not implied.
(2) V
+IN
and V
–IN
are the voltages at the +IN and –IN pins, respectively.
(3) Input voltages must not exceed common-mode rating.
THERMAL INFORMATION
INA282AID,
INA283AID,
INA284AID,
INA285AID,
THERMAL METRIC
(1)
UNITS
INA286AID
D
8
θ
JA
Junction-to-ambient thermal resistance 134.9
θ
JCtop
Junction-to-case (top) thermal resistance 72.9
θ
JB
Junction-to-board thermal resistance 61.3
°C/W
ψ
JT
Junction-to-top characterization parameter 18.9
ψ
JB
Junction-to-board characterization parameter 54.3
θ
JCbot
Junction-to-case (bottom) thermal resistance n/a
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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Product Folder Links: INA282 INA283 INA284 INA285 INA286