Datasheet

LM2594, LM2594HV
SNVS118C –DECEMBER 1999–REVISED APRIL 2013 www.ti.com
Package thermal resistance and junction temperature rise numbers are all approximate, and there are many
factors that will affect the junction temperature. Some of these factors include board size, shape, thickness,
position, location, and even board temperature. Other factors are, trace width, printed circuit copper area, copper
thickness, single- or double-sided, multilayer board, and the amount of solder on the board. The effectiveness of
the PC board to dissipate heat also depends on the size, quantity and spacing of other components on the
board. Furthermore, some of these components such as the catch diode will add heat to the PC board and the
heat can vary as the input voltage changes. For the inductor, depending on the physical size, type of core
material and the DC resistance, it could either act as a heat sink taking heat away from the board, or it could add
heat to the board.
Circuit Data for Temperature Rise Curve (PDIP-8)
Capacitors Through hole electrolytic
Inductor Through hole, Schott, 100 μH
Diode Through hole, 1A 40V, Schottky
PC board 4 square inches single sided 2 oz. copper (0.0028″)
Figure 31. Junction Temperature Rise, PDIP-8
Circuit Data for Temperature Rise Curve
(Surface Mount)
Capacitors Surface mount tantalum, molded “D” size
Inductor Surface mount, Coilcraft DO33, 100 μH
Diode Surface mount, 1A 40V, Schottky
PC board 4 square inches single sided 2 oz. copper (0.0028″)
Figure 32. Junction Temperature Rise, SOIC-8
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