Datasheet

*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM2594HVMX-12/NOPB SOIC D 8 2500 367.0 367.0 35.0
LM2594HVMX-3.3 SOIC D 8 2500 367.0 367.0 35.0
LM2594HVMX-3.3/NOPB SOIC D 8 2500 367.0 367.0 35.0
LM2594HVMX-5.0 SOIC D 8 2500 367.0 367.0 35.0
LM2594HVMX-5.0/NOPB SOIC D 8 2500 367.0 367.0 35.0
LM2594HVMX-ADJ/NOPB SOIC D 8 2500 367.0 367.0 35.0
LM2594MX-12/NOPB SOIC D 8 2500 367.0 367.0 35.0
LM2594MX-3.3/NOPB SOIC D 8 2500 367.0 367.0 35.0
LM2594MX-5.0/NOPB SOIC D 8 2500 367.0 367.0 35.0
LM2594MX-ADJ SOIC D 8 2500 367.0 367.0 35.0
LM2594MX-ADJ/NOPB SOIC D 8 2500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 11-Oct-2013
Pack Materials-Page 2